作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
XLrwxj0 3DNow!(3D no waiting)
,1+y/{S 3DPA(3D Positional Audio,3D定位音频)
)`O~f_pIC 3DS(3D SubSystem,三维子系统)
.0`m\~ L ABS(Auto Balance System,自动平衡系统)
!'9Feoez AC(Audio Codec,音频多媒体数字信号编解码器)
CmoE_8U> ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
v: OR ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
/^#;d
UB AE(Atmospheric Effects,雾化效果)
o9dY9o+Z AFR(Alternate Frame Rendering,交替渲染技术)
'$ t AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
I!Z_[M AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
/Y2}a<3&0 AGU(Address Generation Units,地址产成单元)
U ^5Kz-5. AH: Authentication Header,鉴定文件头
_ =VqrK7T AHA(Accelerated Hub Architecture,加速中心架构)
A"dR{8&0 AL: Artificial Life(人工生命)
LoN< oj5 ALU(Arithmetic Logic Unit,算术逻辑单元)
T~##,qQ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
DrY:9[LP AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
]Hefm?9*^ Anisotropic Filtering(各向异性过滤)
j~jV'f.:H API(Application Programming Interfaces,应用程序接口)
?WqT[MnK APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
/n{omx APM(Advanced Power Management,高级能源管理)
A#J`;5!Sc APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
>8#X;0\Kj ARP(Address Resolution Protocol,地址解析协议)
SPY|K ASC(Anti Static Coatings,防静电涂层)
ORJIo ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
mQ|v26R ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
g'n7T|h
~ ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
9\mLW" ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
Vg>dI&O ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
ic#`N0s? ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
VKG&Y_7N AST(Average Seek time,平均寻道时间)
8h*Icf ATA(AT Attachment,AT扩展型)
tne ST. ATAPI(AT Attachment Packet Interface)
L"1}V ATC(Access Time from Clock,时钟存取时间)
/)}q Xx& ATL: ActiveX Template Library(ActiveX模板库)
PuA9X[= ATM(Asynchronous Transfer Mode,异步传输模式)
K1+)4!}%U ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
TE7nJ gm ATX: AT Extend(扩展型AT)
xg;+<iW Auxiliary Input(辅助输入接口)
YSic-6z0Ms AV(Analog Video,模拟视频)
DN-+osPi AVI(Audio Video Interleave,音频视频插入)
q=Sgk>NA Back Buffer,后置缓冲
%Q
fO8P Backface culling(隐面消除)
'}Z~JYa0 BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
sHt].gZ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
y[)> yq y BCF(Boot Catalog File,启动目录文件)
koZ*+VP= Benchmarks:基准测试程序数值
jD<{t BGA(Ball Grid Array,球状矩阵排列)
uXJ;A * BGA(Ball Grid Array,球状矩阵排列)
/-_h1.! BGA: Ball Grid Array(球状网格阵列)
)f[
B6Y BHT(branch prediction table,分支预测表)
IYS)7`{] BIF(Boot Image File,启动映像文件)
SwTL|+u Bilinear Filtering(双线性过滤)
mpU$+ BIOS(Basic Input/Output System,基本输入/输出系统)
,*&:2o_r BLA: Bearn Landing Area(电子束落区)
_u5#v0Y BMC(Black Matrix Screen,超黑矩阵屏幕)
Mb|a+,:>3 BOD(Bandwidth On Demand,弹性带宽运用)
:toh0oB[ BOPS:Billion Operations Per Second,十亿次运算/秒
K}buH\yco bps(bit per second,位/秒)
.ps-4eXF BPU(Branch Processing Unit,分支处理单元)
yW1)vD7 Brach Pediction(分支预测)
/'l{E BSD(Berkeley Software Distribution,伯克利软件分配代号)
`(ue63AZ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
~obqG!2m BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
4U+xb> C2C: card-to-card interleaving,卡到卡交错存取
7vrl'^ 1 CAD: computer-aided design,计算机辅助设计
S >X:ZYYC CAM(Common Access Model,公共存取模型)
=S+wCN CAS(Column Address Strobe,列地址控制器)
;o2$
Q CBR(Committed Burst Rate,约定突发速率)
IEsEdw]aZE CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
M/>7pZW CCD(Charge Coupled Device,电荷连接设备)
hKLCJ#T CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
+./H6! CCM(Call Control Manager,拨号控制管理)
e,vvzso cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
]6(N@RC CCS(Cut Change System)
.f%fHj CCT(Clock Cycle Time,时钟周期)
K1"*.\?F CDR(CD Recordable,可记录光盘)
?(Dq ?-. CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
VM
GS[qrG CDRW(CD-Rewritable,可重复刻录光盘)
-D CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
(2J: # CE(Consumer Electronics,消费电子)
eg\v0Y!rI CEM(cube environment mapping,立方环境映射)
f_jo+z{-ik Center Processing Unit Utilization,中央处理器占用率
PV'x+bN5 CEO(Chief Executive Officer,首席执行官)
4sF"6+%5d CG(Computer Graphics,计算机生成图像)
:dl]h&C^ CGI(Common Gateway Interface,通用网关接口)
"7'J&^| CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
ZkRx1S"m CIEA: Commercial Internet Exchange Association,商业因特网交易协会
GK)?YM CIR(Committed Infomation Rate,约定信息速率)
+%T\`6 CISC(Complex Instruction Set Computing,复杂指令集计算机)
\qdHX CISC(Complex Instruction Set Computing,复杂指令集计算机)
n$xc];j CISC: Complex Instruction Set Computing(复杂指令结构)
f9t6q*a`% Clipping(剪贴纹理)
W>Y@^U&x` CLK(Clock Cycle,时钟周期)
tZ:_ag)o Clock Synthesizer,时钟合成器
^ =bu(L CLV(Constant Linear Velocity,恒定线速度)
:mh_G CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
a
oD`=I*< CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
z1PBMSG CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
-LK
B$ COB(Cache on board,板上集成缓存)
q0i(i.h COB(Cache on board,板上集成缓存)
8Wrh]egu1 COD(Cache on Die,芯片内集成缓存)
!;&p"E|b# COD(Cache on Die,芯片内集成缓存)
R]}}$R`j COM: Component Object Model(组件对象模式)
q>_/u" COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
.zA^)qgL compressed textures(压缩纹理)
twL3\
}N/B Concurrent Command Engine,协作命令引擎
=x%dNf$e{W COO(Chief Organizer Officer,首席管理官)
2h|MXI\g CP: Ceramic Package(陶瓷封装)
4ni<E* CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
#C~+JL CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
rq8K_zp CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
<Swt); CPS: Certification Practice Statement(使用证明书)
aktU$Wbwl CPU(Center Processing Unit,中央处理器)
[-65PC4aN CPU: Centerl Processing Unit(中央处理器)
iV5yJF{ZH CPU:Center Processing Unit,中央处理器
tvkb~ CRC: Cyclical Redundancy Check(循环冗余检查)
B6u/mo< CRT(Cathode Ray Tube,阴极射线管)
\rx3aJl CS(Channel Separation,声道分离)
1->dMm}G[ CSE(Configuration Space Enable,可分配空间)
jqWu CSS(Common Command Set,通用指令集)
0Is,*Srr CSS: Cascading Style Sheets,层叠格式表
a]JYDq`,3 CTO(Chief Technology Officer,首席技术官)
BWeA@v CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
RkH W
CTS(Clear to Send,清除发送)
x[wq]q#* CVS(Compute Visual Syndrome,计算机视觉综合症)