作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
n~Qo@%Jr 3DNow!(3D no waiting)
mK_2VZj& 3DPA(3D Positional Audio,3D定位音频)
qS?uMms7w 3DS(3D SubSystem,三维子系统)
`E:&a]ul ABS(Auto Balance System,自动平衡系统)
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7I AC(Audio Codec,音频多媒体数字信号编解码器)
e?yrx6 ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
LE]mguvs ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
RTQtXv6mD AE(Atmospheric Effects,雾化效果)
-F~"W@9r AFR(Alternate Frame Rendering,交替渲染技术)
4uy:sCmu AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
9ymx; AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
W\1V`\gF AGU(Address Generation Units,地址产成单元)
=tQ^t4_ AH: Authentication Header,鉴定文件头
0/TP`3$X#" AHA(Accelerated Hub Architecture,加速中心架构)
D4IP$pAD AL: Artificial Life(人工生命)
oUNuM%g9Dy ALU(Arithmetic Logic Unit,算术逻辑单元)
Dhze2q)o AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
Ra)AQ
n AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
_/[}PQC6G Anisotropic Filtering(各向异性过滤)
,qu7XFYrY API(Application Programming Interfaces,应用程序接口)
z;Yo76P APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
L{F[>^1Sb
APM(Advanced Power Management,高级能源管理)
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E^lw61 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
F!qt=)V@w ARP(Address Resolution Protocol,地址解析协议)
o8c5~fG1 ASC(Anti Static Coatings,防静电涂层)
/{%p%Q[X ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
A(}D76o_ ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
.9VhDrCK ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
k^Qd%;bdF ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
Z3qr2/ ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
AQm#a; ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
?)V|L~/ AST(Average Seek time,平均寻道时间)
{YMO8 ATA(AT Attachment,AT扩展型)
./@C ATAPI(AT Attachment Packet Interface)
@Pb%dS ATC(Access Time from Clock,时钟存取时间)
8k9Yoht ATL: ActiveX Template Library(ActiveX模板库)
$i;m9_16 ATM(Asynchronous Transfer Mode,异步传输模式)
TW~%1G_v ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
/H~]5JZ3-E ATX: AT Extend(扩展型AT)
}F4%5go Auxiliary Input(辅助输入接口)
;|r<mT/, AV(Analog Video,模拟视频)
=HHtLW.|, AVI(Audio Video Interleave,音频视频插入)
hEMS Back Buffer,后置缓冲
j^6,V\;l Backface culling(隐面消除)
BK)3b6L=% BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
W'{o`O=GGr Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
4)Ab]CdD BCF(Boot Catalog File,启动目录文件)
E>isl" Benchmarks:基准测试程序数值
pv"QgH BGA(Ball Grid Array,球状矩阵排列)
zXaA5rZO BGA(Ball Grid Array,球状矩阵排列)
2ut)m\)/) BGA: Ball Grid Array(球状网格阵列)
r<OqI*7 BHT(branch prediction table,分支预测表)
p>h}k_s BIF(Boot Image File,启动映像文件)
#&,~5 Bilinear Filtering(双线性过滤)
[pX cKN BIOS(Basic Input/Output System,基本输入/输出系统)
w:h([q4X BLA: Bearn Landing Area(电子束落区)
MHQM' BMC(Black Matrix Screen,超黑矩阵屏幕)
THy{r_dx BOD(Bandwidth On Demand,弹性带宽运用)
AYsiaSTRqW BOPS:Billion Operations Per Second,十亿次运算/秒
u3C0!{v bps(bit per second,位/秒)
o-+H- BPU(Branch Processing Unit,分支处理单元)
AB=Wj*fr Brach Pediction(分支预测)
QP7N#mh BSD(Berkeley Software Distribution,伯克利软件分配代号)
~9Cw5rwH<; BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
99*QfC BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
>=K~*$&> C2C: card-to-card interleaving,卡到卡交错存取
(Qd@Q,@(s CAD: computer-aided design,计算机辅助设计
4Ul*`/d CAM(Common Access Model,公共存取模型)
-'rb+<v CAS(Column Address Strobe,列地址控制器)
t*wV<b CBR(Committed Burst Rate,约定突发速率)
n'9&q]GN| CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
[PH56f CCD(Charge Coupled Device,电荷连接设备)
`N;O6
wZ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
%@^9(xTE CCM(Call Control Manager,拨号控制管理)
![ @i+hl cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Y/]J0D CCS(Cut Change System)
xp%LXxj CCT(Clock Cycle Time,时钟周期)
m2v'zJd}g CDR(CD Recordable,可记录光盘)
L*zfZ& CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
8d[!"lL CDRW(CD-Rewritable,可重复刻录光盘)
4P=)u}{]^# CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
d~;U- CE(Consumer Electronics,消费电子)
1EQLsg`d^ CEM(cube environment mapping,立方环境映射)
ZsN3 MbY Center Processing Unit Utilization,中央处理器占用率
M5c
*vs CEO(Chief Executive Officer,首席执行官)
U92?e}=] CG(Computer Graphics,计算机生成图像)
sNs Hl CGI(Common Gateway Interface,通用网关接口)
4XNkto CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
seiE2F[ CIEA: Commercial Internet Exchange Association,商业因特网交易协会
I<!,_$: CIR(Committed Infomation Rate,约定信息速率)
R_gON*9 CISC(Complex Instruction Set Computing,复杂指令集计算机)
Lm7fz9F% CISC(Complex Instruction Set Computing,复杂指令集计算机)
~}g)N CISC: Complex Instruction Set Computing(复杂指令结构)
?P"j5 Clipping(剪贴纹理)
e$N1m:1* CLK(Clock Cycle,时钟周期)
I>:.fHvUC Clock Synthesizer,时钟合成器
,~>u<Wc!S CLV(Constant Linear Velocity,恒定线速度)
Bxk2P<d CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
ofuQ`g1hb CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
UQO?hZ!y/. CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
+?^lnoX COB(Cache on board,板上集成缓存)
6.6x$y3v COB(Cache on board,板上集成缓存)
yX1OJg[s, COD(Cache on Die,芯片内集成缓存)
V`xE&BI COD(Cache on Die,芯片内集成缓存)
+m4?a\U COM: Component Object Model(组件对象模式)
x }i'2 COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
7'RU\0QG compressed textures(压缩纹理)
(|sqN8SbA Concurrent Command Engine,协作命令引擎
V"5LNtf COO(Chief Organizer Officer,首席管理官)
`o6T)49 CP: Ceramic Package(陶瓷封装)
q(Zu;ecBN CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
S#l)|c_~ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
-~_;9[uV CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
$: qrh66 CPS: Certification Practice Statement(使用证明书)
O4T_p=Xc CPU(Center Processing Unit,中央处理器)
N:UA+ CPU: Centerl Processing Unit(中央处理器)
^3ysY24 Q CPU:Center Processing Unit,中央处理器
Kgb<uXk CRC: Cyclical Redundancy Check(循环冗余检查)
\4n9m CRT(Cathode Ray Tube,阴极射线管)
?<~P)aVVj CS(Channel Separation,声道分离)
wj9Hh CSE(Configuration Space Enable,可分配空间)
`g'z6~c7n CSS(Common Command Set,通用指令集)
5Eu`1f? CSS: Cascading Style Sheets,层叠格式表
EHda CTO(Chief Technology Officer,首席技术官)
]]/p.#oD, CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
N[wyi&m4 CTS(Clear to Send,清除发送)
oD_#oX5\ CVS(Compute Visual Syndrome,计算机视觉综合症)