作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
dy jzF`H 3DNow!(3D no waiting)
2oAPJUPOJ 3DPA(3D Positional Audio,3D定位音频)
l|ZwZix 3DS(3D SubSystem,三维子系统)
cK>5!2b ABS(Auto Balance System,自动平衡系统)
>qjr7 vx AC(Audio Codec,音频多媒体数字信号编解码器)
#(jozl_8 ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
ih?_ fW ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
+0=u] AE(Atmospheric Effects,雾化效果)
I'o9.B8%# AFR(Alternate Frame Rendering,交替渲染技术)
/c`)Er6d AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
W Io^=?% AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
1{% EQhNd AGU(Address Generation Units,地址产成单元)
qeCx.Z AH: Authentication Header,鉴定文件头
]do0{I%\eq AHA(Accelerated Hub Architecture,加速中心架构)
";j/k9DE AL: Artificial Life(人工生命)
56*}}B$? ALU(Arithmetic Logic Unit,算术逻辑单元)
>Ge&v'~_| AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
I<.3"F1} AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
, {7wvXP Anisotropic Filtering(各向异性过滤)
&{* [7Ad API(Application Programming Interfaces,应用程序接口)
}Xs=x6Mj APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
!>/U6h,_ APM(Advanced Power Management,高级能源管理)
i6r%;ueLb APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
Xt/T0.I ARP(Address Resolution Protocol,地址解析协议)
:>'^l?b'WX ASC(Anti Static Coatings,防静电涂层)
w&v_#\T ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
3skq%;%Wsk ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
TeQWrms ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
BpCzmU ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
E`>-+~ZUsk ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
{so"xoA^c ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
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AST(Average Seek time,平均寻道时间)
/yIkHb^c ATA(AT Attachment,AT扩展型)
m4ovppC ATAPI(AT Attachment Packet Interface)
K3?7Hndf2 ATC(Access Time from Clock,时钟存取时间)
QQ97BP7W ATL: ActiveX Template Library(ActiveX模板库)
> K,Q`sS ATM(Asynchronous Transfer Mode,异步传输模式)
E'$r#k:o ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
)KR9al f3 ATX: AT Extend(扩展型AT)
!5 %c`4 Auxiliary Input(辅助输入接口)
PBr-<J AV(Analog Video,模拟视频)
kAf:_0?6 AVI(Audio Video Interleave,音频视频插入)
PP&AF?C Back Buffer,后置缓冲
Y{@ez
Backface culling(隐面消除)
GfY!~J BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
_C"W;n' Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
ro6peUL*2` BCF(Boot Catalog File,启动目录文件)
uKh),@JV Benchmarks:基准测试程序数值
%\[LM$f{z BGA(Ball Grid Array,球状矩阵排列)
R|8)iW^ BGA(Ball Grid Array,球状矩阵排列)
/bVU^vo BGA: Ball Grid Array(球状网格阵列)
+"T?., BHT(branch prediction table,分支预测表)
G F,/<R # BIF(Boot Image File,启动映像文件)
G[6V=G Bilinear Filtering(双线性过滤)
?`,UW; Br6 BIOS(Basic Input/Output System,基本输入/输出系统)
52K3N^RgR BLA: Bearn Landing Area(电子束落区)
Ve7[U_" BMC(Black Matrix Screen,超黑矩阵屏幕)
>t?;*K\x" BOD(Bandwidth On Demand,弹性带宽运用)
A[;R_ BOPS:Billion Operations Per Second,十亿次运算/秒
(C,PGjd bps(bit per second,位/秒)
V?HC\F- BPU(Branch Processing Unit,分支处理单元)
fT/;TK>z> Brach Pediction(分支预测)
Az6f I*yP BSD(Berkeley Software Distribution,伯克利软件分配代号)
_7]* 5Pxo BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
I9ubV cV8 BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
2@1A, C2C: card-to-card interleaving,卡到卡交错存取
&K)c*'l CAD: computer-aided design,计算机辅助设计
{Rjj CAM(Common Access Model,公共存取模型)
[1dlV/ CAS(Column Address Strobe,列地址控制器)
RMmDcvM"k CBR(Committed Burst Rate,约定突发速率)
<;+&`R CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
N4}/n CCD(Charge Coupled Device,电荷连接设备)
Z|uUE CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
>I8R[@ CCM(Call Control Manager,拨号控制管理)
?^2(|t9KU cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
5>"$95D CCS(Cut Change System)
xgL*O>l) CCT(Clock Cycle Time,时钟周期)
)fpZrpLXE CDR(CD Recordable,可记录光盘)
D^I%tn=F CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
Cz
Jze CDRW(CD-Rewritable,可重复刻录光盘)
sk$MJSE
~ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
yFshV\ CE(Consumer Electronics,消费电子)
1'R]An BV CEM(cube environment mapping,立方环境映射)
tH2y:o72 Center Processing Unit Utilization,中央处理器占用率
e[yk'E CEO(Chief Executive Officer,首席执行官)
X|7gj&1 CG(Computer Graphics,计算机生成图像)
]U! ?{~ CGI(Common Gateway Interface,通用网关接口)
Qg C CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
jw5Bbyk CIEA: Commercial Internet Exchange Association,商业因特网交易协会
B:a&)Lwp0 CIR(Committed Infomation Rate,约定信息速率)
%[-D&flKC CISC(Complex Instruction Set Computing,复杂指令集计算机)
U=QV^I Qm CISC(Complex Instruction Set Computing,复杂指令集计算机)
=5oE|F% CISC: Complex Instruction Set Computing(复杂指令结构)
,S2D/Y^> Clipping(剪贴纹理)
y!."FoQ CLK(Clock Cycle,时钟周期)
%rzC+=*; Clock Synthesizer,时钟合成器
:U0z; CLV(Constant Linear Velocity,恒定线速度)
eFp4MD8? CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
B~V^?." CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
41^+T<+ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
/^i7^ COB(Cache on board,板上集成缓存)
ON~SZa COB(Cache on board,板上集成缓存)
xYRN~nr COD(Cache on Die,芯片内集成缓存)
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#P2Qd COD(Cache on Die,芯片内集成缓存)
O2us+DhQ COM: Component Object Model(组件对象模式)
\d2Ku10v[ COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
; ob>$ _ compressed textures(压缩纹理)
+tkDT@ ` Concurrent Command Engine,协作命令引擎
,sn
?V~) COO(Chief Organizer Officer,首席管理官)
BEx?
bf@|] CP: Ceramic Package(陶瓷封装)
\&`S~c V9 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
H.hF`n CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
>> Z.] CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
xD,BlDV CPS: Certification Practice Statement(使用证明书)
"b8<C>wY CPU(Center Processing Unit,中央处理器)
z^T/kK3I CPU: Centerl Processing Unit(中央处理器)
.v9 #|d d+ CPU:Center Processing Unit,中央处理器
>93vMk~hU CRC: Cyclical Redundancy Check(循环冗余检查)
MVs@~= CRT(Cathode Ray Tube,阴极射线管)
[,3o CS(Channel Separation,声道分离)
0g,;Yzm CSE(Configuration Space Enable,可分配空间)
cclx$)X1X CSS(Common Command Set,通用指令集)
'mXf8 CSS: Cascading Style Sheets,层叠格式表
A/|To!R CTO(Chief Technology Officer,首席技术官)
yJ c#y CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
5(^&0c>P CTS(Clear to Send,清除发送)
b<P9@h~: CVS(Compute Visual Syndrome,计算机视觉综合症)