作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
Epsc2TuH7 3DNow!(3D no waiting)
]N}80*Rl 3DPA(3D Positional Audio,3D定位音频)
g@hg u 3DS(3D SubSystem,三维子系统)
Az[Yvu'< ABS(Auto Balance System,自动平衡系统)
!vHUe*1a{ AC(Audio Codec,音频多媒体数字信号编解码器)
1 *'SP6g ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
U)a}XRS ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
x|n2,3% AE(Atmospheric Effects,雾化效果)
.ICGGC`O AFR(Alternate Frame Rendering,交替渲染技术)
BO<I/J~b AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
#DpDmMP9R3 AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
Qy`{y?T2 AGU(Address Generation Units,地址产成单元)
Am&/K\O AH: Authentication Header,鉴定文件头
Zp]{e6J AHA(Accelerated Hub Architecture,加速中心架构)
+{N LziO AL: Artificial Life(人工生命)
=xScHy{$ ALU(Arithmetic Logic Unit,算术逻辑单元)
L,V\g^4$K AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
<Hl.MS AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
v.H00}[. Anisotropic Filtering(各向异性过滤)
, A?o API(Application Programming Interfaces,应用程序接口)
wmdvAMN APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
}Wjb0V APM(Advanced Power Management,高级能源管理)
szN`"Yi){ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
+xMK.*H]W ARP(Address Resolution Protocol,地址解析协议)
L}lOA,EF ASC(Anti Static Coatings,防静电涂层)
E#X1P #$pW ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
0TK+R43_ ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
CsG1HR@ ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
/PF X1hSu ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
znv2: ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
XNkw9*IT ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
W*iPseXq AST(Average Seek time,平均寻道时间)
o,(MB[|hQ ATA(AT Attachment,AT扩展型)
WgPpW!` ATAPI(AT Attachment Packet Interface)
4tU3+e5h ATC(Access Time from Clock,时钟存取时间)
2i`N26On ATL: ActiveX Template Library(ActiveX模板库)
_svY.ps* ATM(Asynchronous Transfer Mode,异步传输模式)
Z5[TmVU ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
<&E3QeK ATX: AT Extend(扩展型AT)
K*jV=lG Auxiliary Input(辅助输入接口)
7sZVN AV(Analog Video,模拟视频)
0<75G6wd AVI(Audio Video Interleave,音频视频插入)
FglCqO} Back Buffer,后置缓冲
J(F]?H Backface culling(隐面消除)
?3jOE4~aHr BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
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X#9V Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
vUh.ev0 BCF(Boot Catalog File,启动目录文件)
CJ0j2e/ Benchmarks:基准测试程序数值
67Rsd2 BGA(Ball Grid Array,球状矩阵排列)
% FW__SN$c BGA(Ball Grid Array,球状矩阵排列)
2
>G"A BGA: Ball Grid Array(球状网格阵列)
ycB>gd BHT(branch prediction table,分支预测表)
[ah%>&u BIF(Boot Image File,启动映像文件)
HV ab14}E Bilinear Filtering(双线性过滤)
' p,QI> BIOS(Basic Input/Output System,基本输入/输出系统)
'aMT^w4if) BLA: Bearn Landing Area(电子束落区)
7JNhCOBB BMC(Black Matrix Screen,超黑矩阵屏幕)
W#!![JDc BOD(Bandwidth On Demand,弹性带宽运用)
-I4-K%%B` BOPS:Billion Operations Per Second,十亿次运算/秒
LyR to bps(bit per second,位/秒)
?LAKH$t BPU(Branch Processing Unit,分支处理单元)
G>f-w F6 Brach Pediction(分支预测)
;hU56lfZ)X BSD(Berkeley Software Distribution,伯克利软件分配代号)
9v&{;
%U BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
4L\bT;dQ|. BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
f@Mm{3&. C2C: card-to-card interleaving,卡到卡交错存取
V4'G%!NY CAD: computer-aided design,计算机辅助设计
,y@`= CAM(Common Access Model,公共存取模型)
aGvD CAS(Column Address Strobe,列地址控制器)
TWE$@/9 )g CBR(Committed Burst Rate,约定突发速率)
M6U/.
n CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
ciO^2X CCD(Charge Coupled Device,电荷连接设备)
}XVz?6 CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
"J^M@k\! CCM(Call Control Manager,拨号控制管理)
3Qmok@4e) cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
^,[V;3 CCS(Cut Change System)
6N[XWyS CCT(Clock Cycle Time,时钟周期)
d51l7't CDR(CD Recordable,可记录光盘)
4SSq5Ve< CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
(r,tU( CDRW(CD-Rewritable,可重复刻录光盘)
Rr+Y::E CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
|r_S2)zH9m CE(Consumer Electronics,消费电子)
1HK5OT& CEM(cube environment mapping,立方环境映射)
~_=ohb{ Center Processing Unit Utilization,中央处理器占用率
O{hGh{y CEO(Chief Executive Officer,首席执行官)
"P;_-i9O CG(Computer Graphics,计算机生成图像)
4Sv&iQ=vh CGI(Common Gateway Interface,通用网关接口)
,p6X3zY CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
[X[d`@rXv CIEA: Commercial Internet Exchange Association,商业因特网交易协会
L>Bf}^ CIR(Committed Infomation Rate,约定信息速率)
r2H_)Oi CISC(Complex Instruction Set Computing,复杂指令集计算机)
qg?O+-+ CISC(Complex Instruction Set Computing,复杂指令集计算机)
Fn0Rq9 /@ CISC: Complex Instruction Set Computing(复杂指令结构)
)? WiO}" Clipping(剪贴纹理)
tkU"/$Vi\ CLK(Clock Cycle,时钟周期)
QHnk@R! Clock Synthesizer,时钟合成器
-ZqN~5>j) CLV(Constant Linear Velocity,恒定线速度)
*fVs| CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
|Q2H^dU'rQ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
)P>Cxzs CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
I4
dS,h COB(Cache on board,板上集成缓存)
/pzEL COB(Cache on board,板上集成缓存)
NltEX14Af COD(Cache on Die,芯片内集成缓存)
U{n< n8 COD(Cache on Die,芯片内集成缓存)
KA1Z{7UK% COM: Component Object Model(组件对象模式)
z1A[rbe=4w COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
_uU}J5d. compressed textures(压缩纹理)
Qk?;n F Concurrent Command Engine,协作命令引擎
#7K&x.w$ COO(Chief Organizer Officer,首席管理官)
p\5DW' CP: Ceramic Package(陶瓷封装)
O@St^o*A} CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
A`2l ;MW CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
~9#[\/;" CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
9Cbf[\J!bq CPS: Certification Practice Statement(使用证明书)
o(5Xj$Z CPU(Center Processing Unit,中央处理器)
JJlwzH CPU: Centerl Processing Unit(中央处理器)
;7CE{/Bq.p CPU:Center Processing Unit,中央处理器
$'!r/jV CRC: Cyclical Redundancy Check(循环冗余检查)
Z'iXuI49 CRT(Cathode Ray Tube,阴极射线管)
Bgs3sM9 CS(Channel Separation,声道分离)
ka3Jqy4[ CSE(Configuration Space Enable,可分配空间)
sS#Lnj^`% CSS(Common Command Set,通用指令集)
2@WF]*Z CSS: Cascading Style Sheets,层叠格式表
`h+ia/ CTO(Chief Technology Officer,首席技术官)
f6n'g:&.W CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
IKSe X CTS(Clear to Send,清除发送)
e-vL!&;2 CVS(Compute Visual Syndrome,计算机视觉综合症)