作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
L4nYXW0y 3DNow!(3D no waiting)
XwaXdvmK 3DPA(3D Positional Audio,3D定位音频)
S<Xf>-8w 3DS(3D SubSystem,三维子系统)
$>LQ6|XRu ABS(Auto Balance System,自动平衡系统)
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AC(Audio Codec,音频多媒体数字信号编解码器)
.?$gpM?i ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
<)D$51 &0 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
]c'A%:f< AE(Atmospheric Effects,雾化效果)
Y76gJ[yjn AFR(Alternate Frame Rendering,交替渲染技术)
. $vK&k AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
]t"Ss_, AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
oUlVI*~ND AGU(Address Generation Units,地址产成单元)
|yPu!pfl AH: Authentication Header,鉴定文件头
"^GGac. AHA(Accelerated Hub Architecture,加速中心架构)
WH^%:4 AL: Artificial Life(人工生命)
o`-msz ALU(Arithmetic Logic Unit,算术逻辑单元)
UkFC~17P AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
]D\D~!R AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
Zj'9rXhrM1 Anisotropic Filtering(各向异性过滤)
RZTiw^ API(Application Programming Interfaces,应用程序接口)
CpTjJXb APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
9hyn`u. APM(Advanced Power Management,高级能源管理)
EfT=? APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
CU!Dhm/U ARP(Address Resolution Protocol,地址解析协议)
o ^uA">GH ASC(Anti Static Coatings,防静电涂层)
}0y"F ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
N8df8=.kw ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
fp"W[S|uL ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
?}Y]|c^W ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
p6S8VA ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
%8v\FS ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
TWX.D`W AST(Average Seek time,平均寻道时间)
~a2}(] ATA(AT Attachment,AT扩展型)
gs`q6f%( ATAPI(AT Attachment Packet Interface)
j1<Yg,_.p ATC(Access Time from Clock,时钟存取时间)
1_G^w
qk ATL: ActiveX Template Library(ActiveX模板库)
M<&= S ATM(Asynchronous Transfer Mode,异步传输模式)
uPvEwq*
C ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
~&uHbTq ATX: AT Extend(扩展型AT)
~"A0Rs= Auxiliary Input(辅助输入接口)
nO-#Q=H, AV(Analog Video,模拟视频)
%BQ`MZ AVI(Audio Video Interleave,音频视频插入)
yB!dp;gM{ Back Buffer,后置缓冲
BTxrp Backface culling(隐面消除)
`WS&rmq&' BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
|N] XJ)? Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
/gas2k==^ BCF(Boot Catalog File,启动目录文件)
lU]nd[x Benchmarks:基准测试程序数值
e|r`/:M BGA(Ball Grid Array,球状矩阵排列)
F"mmLao BGA(Ball Grid Array,球状矩阵排列)
vP,n(reM BGA: Ball Grid Array(球状网格阵列)
-'Mf\h8 BHT(branch prediction table,分支预测表)
q.}CU.dp BIF(Boot Image File,启动映像文件)
!5N.B|Nt Bilinear Filtering(双线性过滤)
(;,sc$H] BIOS(Basic Input/Output System,基本输入/输出系统)
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B$x>Q'C( BLA: Bearn Landing Area(电子束落区)
}-`4DHgq BMC(Black Matrix Screen,超黑矩阵屏幕)
_u Il BOD(Bandwidth On Demand,弹性带宽运用)
'c~4+o4co BOPS:Billion Operations Per Second,十亿次运算/秒
pK4)yu+ bps(bit per second,位/秒)
eJX#@`K BPU(Branch Processing Unit,分支处理单元)
rZpXPI Brach Pediction(分支预测)
C_Wc5{ BSD(Berkeley Software Distribution,伯克利软件分配代号)
H;"4C8K7 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
jiC>d@~y BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
8?C5L8) C2C: card-to-card interleaving,卡到卡交错存取
.S4u- CAD: computer-aided design,计算机辅助设计
&nK<:^n CAM(Common Access Model,公共存取模型)
dF2RH)Ud CAS(Column Address Strobe,列地址控制器)
I`#JwMU;m CBR(Committed Burst Rate,约定突发速率)
4Po_-4 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
i-&yH CCD(Charge Coupled Device,电荷连接设备)
6w7 7YTJ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
q cno^8R CCM(Call Control Manager,拨号控制管理)
Q59W#e) cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
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x*3PE CCS(Cut Change System)
!_(Tqyg& CCT(Clock Cycle Time,时钟周期)
fXB0j;A CDR(CD Recordable,可记录光盘)
S,=|AD CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
fc@A0Hf CDRW(CD-Rewritable,可重复刻录光盘)
j+YJbL v CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
XX~,>Q}H= CE(Consumer Electronics,消费电子)
IGN1gs CEM(cube environment mapping,立方环境映射)
:Tq~8!s Center Processing Unit Utilization,中央处理器占用率
wA.\i CEO(Chief Executive Officer,首席执行官)
nj4/#W CG(Computer Graphics,计算机生成图像)
\`"ht CGI(Common Gateway Interface,通用网关接口)
-{A<.a3P}= CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
"7`<~>9t. CIEA: Commercial Internet Exchange Association,商业因特网交易协会
H)&R=s CIR(Committed Infomation Rate,约定信息速率)
<-0]i_4sK CISC(Complex Instruction Set Computing,复杂指令集计算机)
}1xo-mUg, CISC(Complex Instruction Set Computing,复杂指令集计算机)
?%kV?eu' CISC: Complex Instruction Set Computing(复杂指令结构)
ctV,Q3'Z Clipping(剪贴纹理)
I2DpRMy CLK(Clock Cycle,时钟周期)
H[|~/0?K Clock Synthesizer,时钟合成器
$ulOp;~A% CLV(Constant Linear Velocity,恒定线速度)
B1Oq!k CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
H']+L~j CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
LHmZxi? CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
^}C\zW COB(Cache on board,板上集成缓存)
-.3w^D"l COB(Cache on board,板上集成缓存)
F5#YOck&, COD(Cache on Die,芯片内集成缓存)
qY#6SO`_iy COD(Cache on Die,芯片内集成缓存)
k_R"CKd COM: Component Object Model(组件对象模式)
Qci]i)s$js COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
y!%CffF2 compressed textures(压缩纹理)
LIdF 0 Concurrent Command Engine,协作命令引擎
j~QwV='S COO(Chief Organizer Officer,首席管理官)
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@9zA& CP: Ceramic Package(陶瓷封装)
&~w}_Fjk CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
BPHW}F]X CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
P
}uOJVQ_ CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
HorDNRyu CPS: Certification Practice Statement(使用证明书)
A(0lM`X CPU(Center Processing Unit,中央处理器)
|)G<,FJQE_ CPU: Centerl Processing Unit(中央处理器)
a}uSm/S CPU:Center Processing Unit,中央处理器
{BHO/q3 CRC: Cyclical Redundancy Check(循环冗余检查)
X8`Sf> CRT(Cathode Ray Tube,阴极射线管)
lHIM}~#;nd CS(Channel Separation,声道分离)
8.~kK<)! CSE(Configuration Space Enable,可分配空间)
#o2[hibq CSS(Common Command Set,通用指令集)
]+$?u&0?w CSS: Cascading Style Sheets,层叠格式表
M#[{>6>iE CTO(Chief Technology Officer,首席技术官)
.}*"Nv CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
bYPK h CTS(Clear to Send,清除发送)
2:= CVS(Compute Visual Syndrome,计算机视觉综合症)