作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
RtaMrG=D 3DNow!(3D no waiting)
>dDcm 3DPA(3D Positional Audio,3D定位音频)
T+5H2]yy) 3DS(3D SubSystem,三维子系统)
ronZa0 ABS(Auto Balance System,自动平衡系统)
E.x<J.[Y AC(Audio Codec,音频多媒体数字信号编解码器)
e:QH3|'y ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
j2hp*C'^ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
gb^'u AE(Atmospheric Effects,雾化效果)
`7V'A AFR(Alternate Frame Rendering,交替渲染技术)
^NxKA'oWQ AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
fzjtaH? AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
7zNfq.Ni~ AGU(Address Generation Units,地址产成单元)
r8_MIGM' AH: Authentication Header,鉴定文件头
l>7?B2^<E AHA(Accelerated Hub Architecture,加速中心架构)
P$/Y9o
AL: Artificial Life(人工生命)
\&v)#w ALU(Arithmetic Logic Unit,算术逻辑单元)
"t>H
B6^ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
+5Y;JL<%/ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
>+[{m<Eq Anisotropic Filtering(各向异性过滤)
ge{%B~x API(Application Programming Interfaces,应用程序接口)
$cO-+Mr-~ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
Gx%f&H~Z^ APM(Advanced Power Management,高级能源管理)
ch/DBu APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
O3p<7`K<4 ARP(Address Resolution Protocol,地址解析协议)
-}>H3hr ASC(Anti Static Coatings,防静电涂层)
> mP([] ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
AD'c#CT ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
hi ),PfAV ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
]vCs9* |B ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
GkdxwuRw ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
:-+j,G9t ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
.7Itbp6=R AST(Average Seek time,平均寻道时间)
qi1#s, ATA(AT Attachment,AT扩展型)
6s: ATAPI(AT Attachment Packet Interface)
q:,ck@-4 ATC(Access Time from Clock,时钟存取时间)
P`n"E8"ab< ATL: ActiveX Template Library(ActiveX模板库)
55Ye7P-d ATM(Asynchronous Transfer Mode,异步传输模式)
-wnBdL ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
PW*[(VX ATX: AT Extend(扩展型AT)
qD}O_<_1ym Auxiliary Input(辅助输入接口)
P[P]oT.N
AV(Analog Video,模拟视频)
AT"!Ys| AVI(Audio Video Interleave,音频视频插入)
jXyK[q&O& Back Buffer,后置缓冲
@l~MY*hp Backface culling(隐面消除)
A^7}:[s20 BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
Ec!R3+ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
*,XT;h$'> BCF(Boot Catalog File,启动目录文件)
].N%A07 Benchmarks:基准测试程序数值
[ldx_+xa:E BGA(Ball Grid Array,球状矩阵排列)
69``j{Z+ BGA(Ball Grid Array,球状矩阵排列)
Gwfi BGA: Ball Grid Array(球状网格阵列)
4m_CPe BHT(branch prediction table,分支预测表)
DV~g BIF(Boot Image File,启动映像文件)
K=J">^uW Bilinear Filtering(双线性过滤)
3TT?GgQ BIOS(Basic Input/Output System,基本输入/输出系统)
KyzdJ^xC" BLA: Bearn Landing Area(电子束落区)
9+frxD&pO BMC(Black Matrix Screen,超黑矩阵屏幕)
11-?M BOD(Bandwidth On Demand,弹性带宽运用)
!4+@b
s BOPS:Billion Operations Per Second,十亿次运算/秒
{MmK:C bps(bit per second,位/秒)
S\A9r!2 BPU(Branch Processing Unit,分支处理单元)
JjBlje Brach Pediction(分支预测)
212 BSD(Berkeley Software Distribution,伯克利软件分配代号)
YM +4:P2 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
8wzQr2: BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
5S%#3YHY2 C2C: card-to-card interleaving,卡到卡交错存取
}vX/55 CAD: computer-aided design,计算机辅助设计
^cI RP CAM(Common Access Model,公共存取模型)
@9h6D<? CAS(Column Address Strobe,列地址控制器)
pRh)DM#9 CBR(Committed Burst Rate,约定突发速率)
e:iqv?2t CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
J<ZG&m362p CCD(Charge Coupled Device,电荷连接设备)
.:TSdusr~ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
q>dERN& CCM(Call Control Manager,拨号控制管理)
I- WR6s= cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
x1 1ug CCS(Cut Change System)
W&9X <c* CCT(Clock Cycle Time,时钟周期)
A!_yZ|)$T CDR(CD Recordable,可记录光盘)
20BU;D3 CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
zWq&HBs CDRW(CD-Rewritable,可重复刻录光盘)
ID$%4jl CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
6w$pL( CE(Consumer Electronics,消费电子)
j:J7 CEM(cube environment mapping,立方环境映射)
M{`uI8vD Center Processing Unit Utilization,中央处理器占用率
#j6qq3OG CEO(Chief Executive Officer,首席执行官)
_n!W4zwi CG(Computer Graphics,计算机生成图像)
axiP~t2 CGI(Common Gateway Interface,通用网关接口)
jsIT{a*] CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
SHUn<+/e CIEA: Commercial Internet Exchange Association,商业因特网交易协会
jRSY`MU}t+ CIR(Committed Infomation Rate,约定信息速率)
|&0Cuwt CISC(Complex Instruction Set Computing,复杂指令集计算机)
oJor
]QY K CISC(Complex Instruction Set Computing,复杂指令集计算机)
b:6e2|xf? CISC: Complex Instruction Set Computing(复杂指令结构)
Ve|=<7%%S Clipping(剪贴纹理)
,Zs*07!$f CLK(Clock Cycle,时钟周期)
4k=LVu]Kcr Clock Synthesizer,时钟合成器
Q~$hx{foN CLV(Constant Linear Velocity,恒定线速度)
Gq;!g( CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
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!6I6 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
$or8z2d1 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
9{n?Jy COB(Cache on board,板上集成缓存)
|Ht~o(]&&/ COB(Cache on board,板上集成缓存)
A&qZ:&(OM COD(Cache on Die,芯片内集成缓存)
!wEz=
i COD(Cache on Die,芯片内集成缓存)
q
`^5< COM: Component Object Model(组件对象模式)
} !RBH(m% COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
8H2A<&3i compressed textures(压缩纹理)
a3E.rr;b Concurrent Command Engine,协作命令引擎
MDOP2y`2i COO(Chief Organizer Officer,首席管理官)
LE4P$%>H CP: Ceramic Package(陶瓷封装)
tLe"i> CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
2)+ddel<Z CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
bRK[u\, CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
N#4"P:Sv CPS: Certification Practice Statement(使用证明书)
rn%q*_3-o CPU(Center Processing Unit,中央处理器)
WRfhxl CPU: Centerl Processing Unit(中央处理器)
B-EDVMu CPU:Center Processing Unit,中央处理器
Vi\kB% CRC: Cyclical Redundancy Check(循环冗余检查)
'jd fUB CRT(Cathode Ray Tube,阴极射线管)
C;oT0( CS(Channel Separation,声道分离)
2/#%^,Kb2 CSE(Configuration Space Enable,可分配空间)
g.eMGwonTJ CSS(Common Command Set,通用指令集)
qZ DP- CSS: Cascading Style Sheets,层叠格式表
Tyt1a>!qA CTO(Chief Technology Officer,首席技术官)
JAP4Vwj%j CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
s<fzk1LZ CTS(Clear to Send,清除发送)
=9cN{&qf CVS(Compute Visual Syndrome,计算机视觉综合症)