作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
2wvDC@ 3DNow!(3D no waiting)
-C<aB750O) 3DPA(3D Positional Audio,3D定位音频)
Wno5B/V 3DS(3D SubSystem,三维子系统)
\ }f* ABS(Auto Balance System,自动平衡系统)
xc?<:h" AC(Audio Codec,音频多媒体数字信号编解码器)
rfpxE>_|G ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
4F!d V;"Z( ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
nsk
6a AE(Atmospheric Effects,雾化效果)
R0'EoX AFR(Alternate Frame Rendering,交替渲染技术)
}FVX5/.' AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
g7i6Yj1 AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
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B AGU(Address Generation Units,地址产成单元)
P#PQ4uK \ AH: Authentication Header,鉴定文件头
K(S/D(\
FL AHA(Accelerated Hub Architecture,加速中心架构)
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Lb 9$& AL: Artificial Life(人工生命)
>j3N-;o@? ALU(Arithmetic Logic Unit,算术逻辑单元)
{ VO4""m AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
?Q2pD!L{ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
c-d}E!C: Anisotropic Filtering(各向异性过滤)
w.H+$=aK API(Application Programming Interfaces,应用程序接口)
Jmx}r,j APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
lX3h'h APM(Advanced Power Management,高级能源管理)
|e>-v APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
pM3BBF% ARP(Address Resolution Protocol,地址解析协议)
2oLa`33c1 ASC(Anti Static Coatings,防静电涂层)
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"#Fz ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
Ea?.HRxl ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
F)Lbr>H?I ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
sd%~pY} ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
/G ;yxdb ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
>Z%`&D~u ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
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KXI, AST(Average Seek time,平均寻道时间)
ZbUf|#GTB ATA(AT Attachment,AT扩展型)
p6'8l~W+ ATAPI(AT Attachment Packet Interface)
b??1Up ATC(Access Time from Clock,时钟存取时间)
(P-<9y@ ATL: ActiveX Template Library(ActiveX模板库)
RSC-+c6 1 ATM(Asynchronous Transfer Mode,异步传输模式)
_(foJRr ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
-f=hL7NW ATX: AT Extend(扩展型AT)
/jD'o> Auxiliary Input(辅助输入接口)
$(U|JR@ AV(Analog Video,模拟视频)
9j`-fs@: AVI(Audio Video Interleave,音频视频插入)
mZyTo/\0 Back Buffer,后置缓冲
wQT'~'kL Backface culling(隐面消除)
L8ke*O$ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
q0wVV Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
T^_9R; BCF(Boot Catalog File,启动目录文件)
D2bUSRrb Benchmarks:基准测试程序数值
L_,U*Jyo BGA(Ball Grid Array,球状矩阵排列)
jL SZ#H BGA(Ball Grid Array,球状矩阵排列)
hLRQ) BGA: Ball Grid Array(球状网格阵列)
Z]<_a)> BHT(branch prediction table,分支预测表)
,e2va7}3 BIF(Boot Image File,启动映像文件)
,H*3_c&Q Bilinear Filtering(双线性过滤)
t=AR>M!w~ BIOS(Basic Input/Output System,基本输入/输出系统)
M %~kh" BLA: Bearn Landing Area(电子束落区)
^> fs BMC(Black Matrix Screen,超黑矩阵屏幕)
"L]_NST BOD(Bandwidth On Demand,弹性带宽运用)
yhaYlYv[_3 BOPS:Billion Operations Per Second,十亿次运算/秒
c+=&5=i[3 bps(bit per second,位/秒)
j7&l&)5 BPU(Branch Processing Unit,分支处理单元)
{Y Ymt!Ic Brach Pediction(分支预测)
@V)WJ{ BSD(Berkeley Software Distribution,伯克利软件分配代号)
q]x@q BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
'Nh^SbD+_| BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
bd4q/w4q C2C: card-to-card interleaving,卡到卡交错存取
`Nj|}^A CAD: computer-aided design,计算机辅助设计
)T?ryp3ev CAM(Common Access Model,公共存取模型)
KXJHb{? CAS(Column Address Strobe,列地址控制器)
@zbXG_J CBR(Committed Burst Rate,约定突发速率)
}8HLyK,4 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
AM>:AtY CCD(Charge Coupled Device,电荷连接设备)
JFZ p^{ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
bb{+ CCM(Call Control Manager,拨号控制管理)
8{C3ijR cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
mX89^ CCS(Cut Change System)
fvDwg CCT(Clock Cycle Time,时钟周期)
:9}*p@ CDR(CD Recordable,可记录光盘)
|wDCIHzQ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
!T*izMX} CDRW(CD-Rewritable,可重复刻录光盘)
9=|5-?^ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
Y~R wsx CE(Consumer Electronics,消费电子)
=>G A_ CEM(cube environment mapping,立方环境映射)
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kB` Center Processing Unit Utilization,中央处理器占用率
q`P:PRgM CEO(Chief Executive Officer,首席执行官)
V~;YV]1Y CG(Computer Graphics,计算机生成图像)
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kml3 CGI(Common Gateway Interface,通用网关接口)
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(,2^T'$J CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
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j+-u4b CIEA: Commercial Internet Exchange Association,商业因特网交易协会
t(Uoi~#[ CIR(Committed Infomation Rate,约定信息速率)
&+v&Dd& CISC(Complex Instruction Set Computing,复杂指令集计算机)
+-hmITJv CISC(Complex Instruction Set Computing,复杂指令集计算机)
?D_zAh?pW CISC: Complex Instruction Set Computing(复杂指令结构)
_D~a4tgS Clipping(剪贴纹理)
k{~5pxd-t CLK(Clock Cycle,时钟周期)
z2V!u\It Clock Synthesizer,时钟合成器
D)5wGp CLV(Constant Linear Velocity,恒定线速度)
&kG<LGXP# CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
c\Dv3bF CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
utr_fFu CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
om1 /9 COB(Cache on board,板上集成缓存)
[#:k3aFz COB(Cache on board,板上集成缓存)
<\5{R@A*6 COD(Cache on Die,芯片内集成缓存)
ZU`"^FQ3A COD(Cache on Die,芯片内集成缓存)
.NKN2 COM: Component Object Model(组件对象模式)
;>~iCFk]? COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
^N]*Zf~N? compressed textures(压缩纹理)
@9-qqU@ Concurrent Command Engine,协作命令引擎
$Ix^Rm9c COO(Chief Organizer Officer,首席管理官)
"P6MLf1 CP: Ceramic Package(陶瓷封装)
Xy._&&pt CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
sdb#K?l CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
7$ 'ja CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
9;PtYdJ8 CPS: Certification Practice Statement(使用证明书)
xRfX:3 CPU(Center Processing Unit,中央处理器)
2h=RNU| CPU: Centerl Processing Unit(中央处理器)
wNlp4Z'[ CPU:Center Processing Unit,中央处理器
fRiHs\+ CRC: Cyclical Redundancy Check(循环冗余检查)
Rh=h{O CRT(Cathode Ray Tube,阴极射线管)
{?8rvAjY CS(Channel Separation,声道分离)
i|t$sBIh CSE(Configuration Space Enable,可分配空间)
q45n.A6a CSS(Common Command Set,通用指令集)
c0@v`-9 CSS: Cascading Style Sheets,层叠格式表
344- ~i* CTO(Chief Technology Officer,首席技术官)
r<U }lK CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
MStaP;| CTS(Clear to Send,清除发送)
ek9%Xk8 CVS(Compute Visual Syndrome,计算机视觉综合症)