作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
mw*KLMo42 3DNow!(3D no waiting)
zO((FQ 3DPA(3D Positional Audio,3D定位音频)
{ {+:Vy 3DS(3D SubSystem,三维子系统)
+\RviF[+ ABS(Auto Balance System,自动平衡系统)
ql7N\COoq AC(Audio Codec,音频多媒体数字信号编解码器)
<x1,4a~ ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
>'v{o{k|C ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
Rts.jm>[ AE(Atmospheric Effects,雾化效果)
p~z\&&0U0 AFR(Alternate Frame Rendering,交替渲染技术)
GRAPv|u9[ AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
D<lV WP AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
:oytJhxU AGU(Address Generation Units,地址产成单元)
=xr2-K)e AH: Authentication Header,鉴定文件头
m6o o-muAr AHA(Accelerated Hub Architecture,加速中心架构)
C,$7fW{? AL: Artificial Life(人工生命)
xG|lmYt76 ALU(Arithmetic Logic Unit,算术逻辑单元)
gW^0A)5 AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
y<m}dW6[\ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
/J!~0~F Anisotropic Filtering(各向异性过滤)
{4r } jH API(Application Programming Interfaces,应用程序接口)
OQ+kOE& APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
;RS^^vDm APM(Advanced Power Management,高级能源管理)
s:JQV APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
G& @_,y| ARP(Address Resolution Protocol,地址解析协议)
+oiuulA ASC(Anti Static Coatings,防静电涂层)
R]N"P:wf@ ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
Lv@'v4.({ ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
{;3a^K ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
4YA1~7R ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
!-tVt
D ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
!=]cASPGD ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
@gi / 1 cq AST(Average Seek time,平均寻道时间)
E+P-)bRa ATA(AT Attachment,AT扩展型)
^]9.$$GU\A ATAPI(AT Attachment Packet Interface)
95*=&d ATC(Access Time from Clock,时钟存取时间)
7upN:7D- ATL: ActiveX Template Library(ActiveX模板库)
`FByME ATM(Asynchronous Transfer Mode,异步传输模式)
bf/z
T0 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
Xbc:Vr ATX: AT Extend(扩展型AT)
;M5]XCPk Auxiliary Input(辅助输入接口)
Oe&gTXo AV(Analog Video,模拟视频)
K%YR; )5A AVI(Audio Video Interleave,音频视频插入)
C:RA( Back Buffer,后置缓冲
WnQ+ Backface culling(隐面消除)
:U6Q==B$_ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
8>'vzc/*> Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
7*@BCu6 BCF(Boot Catalog File,启动目录文件)
V-lp';bD Benchmarks:基准测试程序数值
Mc6v BGA(Ball Grid Array,球状矩阵排列)
i)@H BGA(Ball Grid Array,球状矩阵排列)
`Gh#2U BGA: Ball Grid Array(球状网格阵列)
,p6o "- BHT(branch prediction table,分支预测表)
^`f qK4< BIF(Boot Image File,启动映像文件)
~\u?Nf~L Bilinear Filtering(双线性过滤)
CUx[LZR7m BIOS(Basic Input/Output System,基本输入/输出系统)
Ex5LhRe>= BLA: Bearn Landing Area(电子束落区)
CzI/Z+\ BMC(Black Matrix Screen,超黑矩阵屏幕)
sK7b4gmK BOD(Bandwidth On Demand,弹性带宽运用)
ap[Q'=A` BOPS:Billion Operations Per Second,十亿次运算/秒
5)i+x- bps(bit per second,位/秒)
Ha~}NO BPU(Branch Processing Unit,分支处理单元)
)b-KF}]d Brach Pediction(分支预测)
:</KgR0I BSD(Berkeley Software Distribution,伯克利软件分配代号)
y~<_ux, BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
oEsqLh9a| BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
M8|kmF\B C2C: card-to-card interleaving,卡到卡交错存取
6o~CX CAD: computer-aided design,计算机辅助设计
a[RqK# CAM(Common Access Model,公共存取模型)
jUB`=d| CAS(Column Address Strobe,列地址控制器)
.:iO$wjp5 CBR(Committed Burst Rate,约定突发速率)
Q6d>tqW hq CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
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cI!c` CCD(Charge Coupled Device,电荷连接设备)
p;)@R$* CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
y>&
s; CCM(Call Control Manager,拨号控制管理)
$;j{?dvm. cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Gy!bPVe CCS(Cut Change System)
Te H_DVxj CCT(Clock Cycle Time,时钟周期)
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-@Dh6F CDR(CD Recordable,可记录光盘)
#X*=oG CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
wcW}Sv[r CDRW(CD-Rewritable,可重复刻录光盘)
=HHb ]JE CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
qwYq9A$+ CE(Consumer Electronics,消费电子)
g]U!] CEM(cube environment mapping,立方环境映射)
PGA
`R Center Processing Unit Utilization,中央处理器占用率
_Q}vPSJviC CEO(Chief Executive Officer,首席执行官)
#fxdZm, CG(Computer Graphics,计算机生成图像)
i"#zb&~nF CGI(Common Gateway Interface,通用网关接口)
k];fQ7}m<0 CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
JjQ9AJ?-V CIEA: Commercial Internet Exchange Association,商业因特网交易协会
(w?W=guHu CIR(Committed Infomation Rate,约定信息速率)
zI'c 'X1, CISC(Complex Instruction Set Computing,复杂指令集计算机)
D"X`qF6U7 CISC(Complex Instruction Set Computing,复杂指令集计算机)
[[KIuW~ot CISC: Complex Instruction Set Computing(复杂指令结构)
|L~RC Clipping(剪贴纹理)
PB!*&T'! CLK(Clock Cycle,时钟周期)
.gA4gI1kH Clock Synthesizer,时钟合成器
7
'{wl,u CLV(Constant Linear Velocity,恒定线速度)
5>&C.+A 9 CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
^']*UD; CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
td|O #R CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
XO}v8nWV COB(Cache on board,板上集成缓存)
bP{uZnOM2P COB(Cache on board,板上集成缓存)
~4M?[E& COD(Cache on Die,芯片内集成缓存)
z`Xc] cPi COD(Cache on Die,芯片内集成缓存)
_OJ19 Ry COM: Component Object Model(组件对象模式)
@O)1Hnm COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
TFtD>q X compressed textures(压缩纹理)
R^Y_i Concurrent Command Engine,协作命令引擎
^'$P[ COO(Chief Organizer Officer,首席管理官)
|/;X-+f8 CP: Ceramic Package(陶瓷封装)
"PC9[i CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
y@\J7 h: CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
2UEjn>2 CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
94L>%{59 CPS: Certification Practice Statement(使用证明书)
mxl"Y&l2< CPU(Center Processing Unit,中央处理器)
n4
J*04K CPU: Centerl Processing Unit(中央处理器)
G/&Wc2k CPU:Center Processing Unit,中央处理器
(BY5omlh CRC: Cyclical Redundancy Check(循环冗余检查)
pt~b=+bBm CRT(Cathode Ray Tube,阴极射线管)
]Yt,|CPe2 CS(Channel Separation,声道分离)
N|asr, CSE(Configuration Space Enable,可分配空间)
Hw~?%g:<S CSS(Common Command Set,通用指令集)
;a`I8F j CSS: Cascading Style Sheets,层叠格式表
]SNcL[U CTO(Chief Technology Officer,首席技术官)
=B"^#n ; CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
=xM:8
hm CTS(Clear to Send,清除发送)
vp`s< ;CA CVS(Compute Visual Syndrome,计算机视觉综合症)