作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
K_n%`5 3DNow!(3D no waiting)
gwNkjI=, 3DPA(3D Positional Audio,3D定位音频)
pj]<i.p 3DS(3D SubSystem,三维子系统)
3/FB>w gt ABS(Auto Balance System,自动平衡系统)
oD\+ 5[x AC(Audio Codec,音频多媒体数字信号编解码器)
@CF4:NNHw ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
hhhO+D1( ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
e r$ 'c AE(Atmospheric Effects,雾化效果)
GK&Dd"v AFR(Alternate Frame Rendering,交替渲染技术)
E76:}( AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
BUyA] AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
--kK<9J7 AGU(Address Generation Units,地址产成单元)
sKO
;p AH: Authentication Header,鉴定文件头
)zo ;r!eP AHA(Accelerated Hub Architecture,加速中心架构)
'%N)(S`O7P AL: Artificial Life(人工生命)
KL4/"$l] ALU(Arithmetic Logic Unit,算术逻辑单元)
Q@n k T1o AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
e IA=?k.y AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
J]B5w{??b Anisotropic Filtering(各向异性过滤)
N<99K! API(Application Programming Interfaces,应用程序接口)
z?,5v`,t2 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
<bI,y_<K APM(Advanced Power Management,高级能源管理)
p;Kr664 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
[dMxr9M ARP(Address Resolution Protocol,地址解析协议)
:^a$ve3(Jq ASC(Anti Static Coatings,防静电涂层)
,-)1)R\. ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
/$(D>KU ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
vNGvEJ`qn ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
( Iew%U ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
W:\VFPf2 ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
gzF&7trN ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
.~J^`/o AST(Average Seek time,平均寻道时间)
^h=kJR9 ATA(AT Attachment,AT扩展型)
h6/Z_Y ATAPI(AT Attachment Packet Interface)
Lt_]3go ATC(Access Time from Clock,时钟存取时间)
+F|[9o z ATL: ActiveX Template Library(ActiveX模板库)
9OUhV[D ATM(Asynchronous Transfer Mode,异步传输模式)
S}X:LHr* ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
4NV1v&" ATX: AT Extend(扩展型AT)
S##W_OlrI Auxiliary Input(辅助输入接口)
fF%r$`2 AV(Analog Video,模拟视频)
jQ*Qh AVI(Audio Video Interleave,音频视频插入)
o@. !Z8 Back Buffer,后置缓冲
s8Oz^5p( Backface culling(隐面消除)
#SueT"F BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
WM26-nR Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
A_%w(7o" BCF(Boot Catalog File,启动目录文件)
k1J}9HNYR Benchmarks:基准测试程序数值
/
yCV-L2J BGA(Ball Grid Array,球状矩阵排列)
1zRO==b BGA(Ball Grid Array,球状矩阵排列)
M &J*I BGA: Ball Grid Array(球状网格阵列)
]mSVjF3l BHT(branch prediction table,分支预测表)
. {I7sUQ BIF(Boot Image File,启动映像文件)
qb&*,zN Bilinear Filtering(双线性过滤)
zeX?]@]Y BIOS(Basic Input/Output System,基本输入/输出系统)
A7H=#L+C BLA: Bearn Landing Area(电子束落区)
S[M$> BMC(Black Matrix Screen,超黑矩阵屏幕)
EX_&wep@1 BOD(Bandwidth On Demand,弹性带宽运用)
RS~oSoAE BOPS:Billion Operations Per Second,十亿次运算/秒
xpz
Jt2S bps(bit per second,位/秒)
#'qW?8d} BPU(Branch Processing Unit,分支处理单元)
o=ex{g( 3 Brach Pediction(分支预测)
wr`eBPu BSD(Berkeley Software Distribution,伯克利软件分配代号)
I8y\D, BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
8J} J;Ga BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
U|=y&a2Rb C2C: card-to-card interleaving,卡到卡交错存取
''G@n* CAD: computer-aided design,计算机辅助设计
zx27aZ[ CAM(Common Access Model,公共存取模型)
D%zIm,bf CAS(Column Address Strobe,列地址控制器)
5zU$_ M CBR(Committed Burst Rate,约定突发速率)
# /T)9 =m CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
v!2`hqO CCD(Charge Coupled Device,电荷连接设备)
;I>`!|mT CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
Liofv4![ CCM(Call Control Manager,拨号控制管理)
rAWBuEU;! cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
D+OkD-8q CCS(Cut Change System)
9E5B.qlw$l CCT(Clock Cycle Time,时钟周期)
~c4Y*]J CDR(CD Recordable,可记录光盘)
{PZe!EQ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
XIU2l}g CDRW(CD-Rewritable,可重复刻录光盘)
?G@%haqn6 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
;RXv%ML CE(Consumer Electronics,消费电子)
V%))%?3x_ CEM(cube environment mapping,立方环境映射)
52oR^| Center Processing Unit Utilization,中央处理器占用率
SLW1]ZaG CEO(Chief Executive Officer,首席执行官)
&f[[@EF7 CG(Computer Graphics,计算机生成图像)
1z)+P1nH] CGI(Common Gateway Interface,通用网关接口)
\>+gZc]an CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
PqfH}d0l CIEA: Commercial Internet Exchange Association,商业因特网交易协会
p?Y1^/
CIR(Committed Infomation Rate,约定信息速率)
d97wiE/i< CISC(Complex Instruction Set Computing,复杂指令集计算机)
*fE5Z;!} CISC(Complex Instruction Set Computing,复杂指令集计算机)
*{uu_O CISC: Complex Instruction Set Computing(复杂指令结构)
)[A}h'J) Clipping(剪贴纹理)
,W.O*vCA CLK(Clock Cycle,时钟周期)
Mf?4 `LM Clock Synthesizer,时钟合成器
-Jb
I7Le CLV(Constant Linear Velocity,恒定线速度)
#p^D([k
\ CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
uy$o%NL-7 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
_$r+*nGDz CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
d<y
B ~Y COB(Cache on board,板上集成缓存)
fSj^/> COB(Cache on board,板上集成缓存)
f.!cR3XgV COD(Cache on Die,芯片内集成缓存)
74Lq!e3hMF COD(Cache on Die,芯片内集成缓存)
h-<+Pj c COM: Component Object Model(组件对象模式)
qu?D`29 COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
t JJaIb6Xj compressed textures(压缩纹理)
5z0SjQ Concurrent Command Engine,协作命令引擎
by-B).7 COO(Chief Organizer Officer,首席管理官)
b( wiJ&t CP: Ceramic Package(陶瓷封装)
Zvc{o8^z CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
G*ecM`Bl CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
1&U U6| X CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
/MA4Er r CPS: Certification Practice Statement(使用证明书)
TtHqdKL CPU(Center Processing Unit,中央处理器)
dD=dPi# CPU: Centerl Processing Unit(中央处理器)
xR$xAcoSB CPU:Center Processing Unit,中央处理器
dH8H<K~ CRC: Cyclical Redundancy Check(循环冗余检查)
^27r-0|l^ CRT(Cathode Ray Tube,阴极射线管)
|@Bl?Bs+ CS(Channel Separation,声道分离)
&Prx=L` CSE(Configuration Space Enable,可分配空间)
)8yNqnD CSS(Common Command Set,通用指令集)
(R{WJjj CSS: Cascading Style Sheets,层叠格式表
4jvgyi9
CTO(Chief Technology Officer,首席技术官)
O0e6I&u: CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
%;GDg3L[p CTS(Clear to Send,清除发送)
geua8; CVS(Compute Visual Syndrome,计算机视觉综合症)