作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
~/Ry=8 3DNow!(3D no waiting)
uL= \t= 3DPA(3D Positional Audio,3D定位音频)
[AGm%o=) 3DS(3D SubSystem,三维子系统)
REsThB ABS(Auto Balance System,自动平衡系统)
" DFg" AC(Audio Codec,音频多媒体数字信号编解码器)
fklMYu4:n ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
b"Ulc}$/& ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
Vw#07P#A AE(Atmospheric Effects,雾化效果)
WFdS#XfV AFR(Alternate Frame Rendering,交替渲染技术)
\:#b9t{B- AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
tDwXb> AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
'-~86Q AGU(Address Generation Units,地址产成单元)
KA< AH: Authentication Header,鉴定文件头
H_2hr[ AHA(Accelerated Hub Architecture,加速中心架构)
<zUmcZ AL: Artificial Life(人工生命)
*X>rvAd3 ALU(Arithmetic Logic Unit,算术逻辑单元)
[v&_MQ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
*%8us~w5/ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
$C>EnNx Anisotropic Filtering(各向异性过滤)
9Z* vp^3 API(Application Programming Interfaces,应用程序接口)
N ;hq APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
@s[bRp`gd APM(Advanced Power Management,高级能源管理)
XR&*g1 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
V]8fn MH ARP(Address Resolution Protocol,地址解析协议)
{P3,jY^ ASC(Anti Static Coatings,防静电涂层)
1jF}g`At ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
4+~+`3;~v ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
yA_d${n ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
HW d,1 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
D"Xm9
( ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
R5FjJ>JE ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
ox*Ka] AST(Average Seek time,平均寻道时间)
|~/{lE=I ATA(AT Attachment,AT扩展型)
p\HXE4d' ATAPI(AT Attachment Packet Interface)
IW46-;l7 ATC(Access Time from Clock,时钟存取时间)
?L
$KlF Y ATL: ActiveX Template Library(ActiveX模板库)
M aEh8* ATM(Asynchronous Transfer Mode,异步传输模式)
`#UTOYx4 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
N,O[pTwj ATX: AT Extend(扩展型AT)
[J]; Auxiliary Input(辅助输入接口)
AsLAm#zq AV(Analog Video,模拟视频)
|p+VitM7 AVI(Audio Video Interleave,音频视频插入)
+X&B' Back Buffer,后置缓冲
Ry(!<w, Backface culling(隐面消除)
qd.b&i BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
B}jZ~/D} Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
O{4m-; BCF(Boot Catalog File,启动目录文件)
Ug"B/UUFd Benchmarks:基准测试程序数值
l5MxJ>?4%B BGA(Ball Grid Array,球状矩阵排列)
+:t1P V;l BGA(Ball Grid Array,球状矩阵排列)
hb_Ia]b BGA: Ball Grid Array(球状网格阵列)
x|Ei_hI- BHT(branch prediction table,分支预测表)
3)xV-Y9 BIF(Boot Image File,启动映像文件)
eGE,zkj
FY Bilinear Filtering(双线性过滤)
<O*q;&9 BIOS(Basic Input/Output System,基本输入/输出系统)
!1l2KW<be BLA: Bearn Landing Area(电子束落区)
dfrq8n] BMC(Black Matrix Screen,超黑矩阵屏幕)
!!QMcx_C#/ BOD(Bandwidth On Demand,弹性带宽运用)
EmH{G BOPS:Billion Operations Per Second,十亿次运算/秒
ucn aj| bps(bit per second,位/秒)
mkWIJH BPU(Branch Processing Unit,分支处理单元)
XI0O^[/n{ Brach Pediction(分支预测)
U/ZbE?it> BSD(Berkeley Software Distribution,伯克利软件分配代号)
}C'z$i( y BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
6>"0H/y, BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
n% *u;iG C2C: card-to-card interleaving,卡到卡交错存取
gC3{:MC-G CAD: computer-aided design,计算机辅助设计
wb{y]~&6K CAM(Common Access Model,公共存取模型)
*n*OVI8L CAS(Column Address Strobe,列地址控制器)
wF%XM_M CBR(Committed Burst Rate,约定突发速率)
*yf+5q4t CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
kY|_wDBSb\ CCD(Charge Coupled Device,电荷连接设备)
+-oXW>`& CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
Mz06cw& CCM(Call Control Manager,拨号控制管理)
USbiI% cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Gzs x0%`) CCS(Cut Change System)
'`RCNk5l CCT(Clock Cycle Time,时钟周期)
e88JT_zrO CDR(CD Recordable,可记录光盘)
/M#A[tZ3 CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
'*T7tl CDRW(CD-Rewritable,可重复刻录光盘)
z><JbSE? CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
E u@TCw8@ CE(Consumer Electronics,消费电子)
>GjaA1, CEM(cube environment mapping,立方环境映射)
FVSz[n Center Processing Unit Utilization,中央处理器占用率
8Yj(/S3y CEO(Chief Executive Officer,首席执行官)
<Ei|:m CG(Computer Graphics,计算机生成图像)
We9mkwK7C CGI(Common Gateway Interface,通用网关接口)
fEpY3od CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
ja:%j&: CIEA: Commercial Internet Exchange Association,商业因特网交易协会
1{,WY(,c CIR(Committed Infomation Rate,约定信息速率)
o`#;[
CISC(Complex Instruction Set Computing,复杂指令集计算机)
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O2x CISC(Complex Instruction Set Computing,复杂指令集计算机)
[Ea5Bn;~! CISC: Complex Instruction Set Computing(复杂指令结构)
7' 6m;b~F Clipping(剪贴纹理)
Yd,*LYd2EL CLK(Clock Cycle,时钟周期)
u'N'<(\k Clock Synthesizer,时钟合成器
9 ROKueP CLV(Constant Linear Velocity,恒定线速度)
3*;{C|]S CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
O,bj_CW x CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
5!5P\o CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
:hevBBP COB(Cache on board,板上集成缓存)
"'PDreS COB(Cache on board,板上集成缓存)
Lb];P"2e+ COD(Cache on Die,芯片内集成缓存)
IUZsLNW COD(Cache on Die,芯片内集成缓存)
eag$i.^aS COM: Component Object Model(组件对象模式)
!WY@)qlf COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
@z2RMEC~ compressed textures(压缩纹理)
+/Z:L$C6 Concurrent Command Engine,协作命令引擎
P_qxw-s COO(Chief Organizer Officer,首席管理官)
\n`]QN CP: Ceramic Package(陶瓷封装)
NZD
X93 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
[pOU!9v4 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
1di?@F2f CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
}vm17`Gfy CPS: Certification Practice Statement(使用证明书)
nmgW>U0jZh CPU(Center Processing Unit,中央处理器)
YZoH{p9f CPU: Centerl Processing Unit(中央处理器)
FV^kOz CPU:Center Processing Unit,中央处理器
e%qMrR CRC: Cyclical Redundancy Check(循环冗余检查)
doe[f_\ CRT(Cathode Ray Tube,阴极射线管)
ufm#H#n)#X CS(Channel Separation,声道分离)
;%%=G;b9 CSE(Configuration Space Enable,可分配空间)
c\R!z&y~ CSS(Common Command Set,通用指令集)
a|fyo#L CSS: Cascading Style Sheets,层叠格式表
;`xu)08a CTO(Chief Technology Officer,首席技术官)
mp5]=6~:m CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
O4}cv CTS(Clear to Send,清除发送)
Dm5UQe CVS(Compute Visual Syndrome,计算机视觉综合症)