作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
0M!0JJy#* 3DNow!(3D no waiting)
cb+y9wA 3DPA(3D Positional Audio,3D定位音频)
G:+16XCra 3DS(3D SubSystem,三维子系统)
7~.ZE ABS(Auto Balance System,自动平衡系统)
{;RF AC(Audio Codec,音频多媒体数字信号编解码器)
^tE_LL+ji| ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
Z H-5Qy_ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
*caLN,G AE(Atmospheric Effects,雾化效果)
M'u=H AFR(Alternate Frame Rendering,交替渲染技术)
,RK3eQ AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
/_OOPt=G AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
atnQC AGU(Address Generation Units,地址产成单元)
('WY5Yps AH: Authentication Header,鉴定文件头
##~!M(c AHA(Accelerated Hub Architecture,加速中心架构)
Xu]h$%W AL: Artificial Life(人工生命)
_'c+fG
\ ALU(Arithmetic Logic Unit,算术逻辑单元)
%8Yyj{^!( AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
_W9&J&l0so AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
rbh[j@s@ Anisotropic Filtering(各向异性过滤)
zUQe0Gc.b^ API(Application Programming Interfaces,应用程序接口)
]C)|+`XE@ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
t-lv|%+8 APM(Advanced Power Management,高级能源管理)
:Y.e[@!1x APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
~L){O*Z ARP(Address Resolution Protocol,地址解析协议)
TSXTc' ASC(Anti Static Coatings,防静电涂层)
.}p|`3$P ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
G^KC&
ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
@^wpAQfd4 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
('BLU.7IX ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
9r8D*PvS ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
t&f" jPu> ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
<3Fz>}V32 AST(Average Seek time,平均寻道时间)
YKq0f=Ij ATA(AT Attachment,AT扩展型)
L1MrrC ATAPI(AT Attachment Packet Interface)
lM&UFEl-\ ATC(Access Time from Clock,时钟存取时间)
;Vo mFp L ATL: ActiveX Template Library(ActiveX模板库)
=, TS MV ATM(Asynchronous Transfer Mode,异步传输模式)
U?EG6t ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
(fd[P|G_] ATX: AT Extend(扩展型AT)
QT_^M1% Auxiliary Input(辅助输入接口)
?360SQ< AV(Analog Video,模拟视频)
w -dI<s AVI(Audio Video Interleave,音频视频插入)
#ko6L3Pi Back Buffer,后置缓冲
sy.:T]ZH Backface culling(隐面消除)
cKpQr7]ur BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
28+HKbgK Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
@H4wHlb BCF(Boot Catalog File,启动目录文件)
kd`YSkZ Benchmarks:基准测试程序数值
EP0a1.C BGA(Ball Grid Array,球状矩阵排列)
OequU'j BGA(Ball Grid Array,球状矩阵排列)
)]}$ BGA: Ball Grid Array(球状网格阵列)
t[ q3{- BHT(branch prediction table,分支预测表)
h&$Py BIF(Boot Image File,启动映像文件)
7V/Zr Bilinear Filtering(双线性过滤)
I}ndRDz[ BIOS(Basic Input/Output System,基本输入/输出系统)
.pKN4 BLA: Bearn Landing Area(电子束落区)
0lf"w@/ BMC(Black Matrix Screen,超黑矩阵屏幕)
/1N)d?Pcl BOD(Bandwidth On Demand,弹性带宽运用)
Xr2 Wa BOPS:Billion Operations Per Second,十亿次运算/秒
}JGq 1 bps(bit per second,位/秒)
%Y 2G BPU(Branch Processing Unit,分支处理单元)
0/*X=5 Brach Pediction(分支预测)
q06@SD$
BSD(Berkeley Software Distribution,伯克利软件分配代号)
4%>+Wh[ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
43F^J%G BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
:P"9;$FY C2C: card-to-card interleaving,卡到卡交错存取
:1NYpsd.i CAD: computer-aided design,计算机辅助设计
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dM@>5[ CAM(Common Access Model,公共存取模型)
?M]u$Te/. CAS(Column Address Strobe,列地址控制器)
X$ PS(_M CBR(Committed Burst Rate,约定突发速率)
;Lqm#]C CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
I2W{tl CCD(Charge Coupled Device,电荷连接设备)
'Dq"e$JM< CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
O E]~@eU CCM(Call Control Manager,拨号控制管理)
CL )%p"[x cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
_UaPwJ CCS(Cut Change System)
XJ
_%! CCT(Clock Cycle Time,时钟周期)
ZgK@Fl*k CDR(CD Recordable,可记录光盘)
tB!|p 6 CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
gvK"*aIj CDRW(CD-Rewritable,可重复刻录光盘)
^:U;rHY CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
g.=!3e&z% CE(Consumer Electronics,消费电子)
s1v{~xP CEM(cube environment mapping,立方环境映射)
%27G 2^1 Center Processing Unit Utilization,中央处理器占用率
H'']J9O CEO(Chief Executive Officer,首席执行官)
Mi;Tn;3er CG(Computer Graphics,计算机生成图像)
:g/{(#E@Z CGI(Common Gateway Interface,通用网关接口)
{YfYIt=. CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
DSTx#* CIEA: Commercial Internet Exchange Association,商业因特网交易协会
TiTYs CIR(Committed Infomation Rate,约定信息速率)
5%#i79z&B CISC(Complex Instruction Set Computing,复杂指令集计算机)
-/1d& CISC(Complex Instruction Set Computing,复杂指令集计算机)
l2r>|CGQ[ CISC: Complex Instruction Set Computing(复杂指令结构)
vevx|<9, Clipping(剪贴纹理)
?SB5b , CLK(Clock Cycle,时钟周期)
'2j~WUEmg Clock Synthesizer,时钟合成器
sgR
9d CLV(Constant Linear Velocity,恒定线速度)
zEAx:6`c CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
hN!.@L CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
k:W=5{[ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
m/cx|b3hqv COB(Cache on board,板上集成缓存)
Mru~<:9 COB(Cache on board,板上集成缓存)
^=3 ^HQ'Zm COD(Cache on Die,芯片内集成缓存)
hg!x_Eq| COD(Cache on Die,芯片内集成缓存)
2Sv>C `FMU COM: Component Object Model(组件对象模式)
miWw6!() COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
f)qPFM]%z compressed textures(压缩纹理)
zabw!@] Concurrent Command Engine,协作命令引擎
%jpH:-8'2 COO(Chief Organizer Officer,首席管理官)
%OTQRe: CP: Ceramic Package(陶瓷封装)
BR%{bY^
5p CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
0VG^GKmx CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
$2;-q8+ CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
Xk;Uk[ CPS: Certification Practice Statement(使用证明书)
vxF:vI# @ CPU(Center Processing Unit,中央处理器)
kK08W3@&t CPU: Centerl Processing Unit(中央处理器)
T$f:[ye]Z CPU:Center Processing Unit,中央处理器
zv&ePq\# CRC: Cyclical Redundancy Check(循环冗余检查)
m<~>&mWr CRT(Cathode Ray Tube,阴极射线管)
9$8X>T^ CS(Channel Separation,声道分离)
$]xE$dzJ CSE(Configuration Space Enable,可分配空间)
"Fo CSS(Common Command Set,通用指令集)
rE9Ta8j6 CSS: Cascading Style Sheets,层叠格式表
3{I=.mUUm CTO(Chief Technology Officer,首席技术官)
@<0h"i
x CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
&`-_)~5] CTS(Clear to Send,清除发送)
#vnefIcBf CVS(Compute Visual Syndrome,计算机视觉综合症)