作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
^hLAMaR 3DNow!(3D no waiting)
)p 2kx 3DPA(3D Positional Audio,3D定位音频)
}ufH![|[r 3DS(3D SubSystem,三维子系统)
rtC.!].;% ABS(Auto Balance System,自动平衡系统)
iE>T5XV8$B AC(Audio Codec,音频多媒体数字信号编解码器)
TTu<~GH ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
!@5B:n* ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
u|i.6:/= AE(Atmospheric Effects,雾化效果)
fmFh.m.+N AFR(Alternate Frame Rendering,交替渲染技术)
6/ F]ncwG AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
aNw8][ AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
d'q,:="c AGU(Address Generation Units,地址产成单元)
?bW|~<X~ AH: Authentication Header,鉴定文件头
u6;SgPw AHA(Accelerated Hub Architecture,加速中心架构)
QF
Vy2 q AL: Artificial Life(人工生命)
r,a V11{ ALU(Arithmetic Logic Unit,算术逻辑单元)
X)x$h{ OE AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
HOBM?|37CU AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
EN'}+E
8 Anisotropic Filtering(各向异性过滤)
m&cVda/ API(Application Programming Interfaces,应用程序接口)
^*`hJ48u APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
Fn1|Wt* APM(Advanced Power Management,高级能源管理)
J1KV?aR APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
rISg`- ARP(Address Resolution Protocol,地址解析协议)
p78X,44xg ASC(Anti Static Coatings,防静电涂层)
*+rO3% ;t ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
zq _*)V ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
iW9G0Ay ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
]+Ik/+Nz ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
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c%6GE ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
rK7m( ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
9Eu.Y AST(Average Seek time,平均寻道时间)
Kj.4Z+^ ATA(AT Attachment,AT扩展型)
:*k ATAPI(AT Attachment Packet Interface)
f+d[Q1 ATC(Access Time from Clock,时钟存取时间)
ha&2V= ATL: ActiveX Template Library(ActiveX模板库)
@Ge\odfF: ATM(Asynchronous Transfer Mode,异步传输模式)
ef *Vs ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
vu Vcv
ATX: AT Extend(扩展型AT)
Z]jm.'@z@ Auxiliary Input(辅助输入接口)
5R"iF+p4 AV(Analog Video,模拟视频)
t Y'fFz^Ho AVI(Audio Video Interleave,音频视频插入)
2Sz?r d,0f Back Buffer,后置缓冲
Bs:INvhYW Backface culling(隐面消除)
f_I6g uDPz BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
#0GvL=}k Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
* `1W}) BCF(Boot Catalog File,启动目录文件)
/N>f#:} Benchmarks:基准测试程序数值
Wo+fMn(O BGA(Ball Grid Array,球状矩阵排列)
sba+J:#w BGA(Ball Grid Array,球状矩阵排列)
/?C}PM BGA: Ball Grid Array(球状网格阵列)
xy;u"JY* BHT(branch prediction table,分支预测表)
cdY|z]B BIF(Boot Image File,启动映像文件)
`\Z7It?aDs Bilinear Filtering(双线性过滤)
7|bzopLJk BIOS(Basic Input/Output System,基本输入/输出系统)
RE6dN BLA: Bearn Landing Area(电子束落区)
]6#bp, BMC(Black Matrix Screen,超黑矩阵屏幕)
HtFc+%= BOD(Bandwidth On Demand,弹性带宽运用)
wA$ JDf)Vg BOPS:Billion Operations Per Second,十亿次运算/秒
}RvinF:5 bps(bit per second,位/秒)
-q'G]} BPU(Branch Processing Unit,分支处理单元)
Okxuhzn>" Brach Pediction(分支预测)
F5s Pd BSD(Berkeley Software Distribution,伯克利软件分配代号)
X2\1OWR0 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
j%%& G$Tfu BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
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?!\ C2C: card-to-card interleaving,卡到卡交错存取
}JPLhr|d^ CAD: computer-aided design,计算机辅助设计
Pr|BhX CAM(Common Access Model,公共存取模型)
$z[FL=h)?+ CAS(Column Address Strobe,列地址控制器)
kMd1)6%6A CBR(Committed Burst Rate,约定突发速率)
Ww\M3Q`h CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
bYt[/K, CCD(Charge Coupled Device,电荷连接设备)
0[E}[{t` CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
N=%4V CCM(Call Control Manager,拨号控制管理)
"=H(\V cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
0Ez(;4]3 CCS(Cut Change System)
/h6K"w=='! CCT(Clock Cycle Time,时钟周期)
U4s)3jDw CDR(CD Recordable,可记录光盘)
cCa+UTxaJ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
(t[sSl CDRW(CD-Rewritable,可重复刻录光盘)
-,YoVB!T CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
|YEq<wbQ CE(Consumer Electronics,消费电子)
xNAX)v3Z CEM(cube environment mapping,立方环境映射)
aq,Ab~V] Center Processing Unit Utilization,中央处理器占用率
~[a6 CEO(Chief Executive Officer,首席执行官)
v_G1YC7TU CG(Computer Graphics,计算机生成图像)
L/*D5k%J CGI(Common Gateway Interface,通用网关接口)
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'7 CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
7H=V|Btnc CIEA: Commercial Internet Exchange Association,商业因特网交易协会
V)<Jj CIR(Committed Infomation Rate,约定信息速率)
p#;I4d G CISC(Complex Instruction Set Computing,复杂指令集计算机)
:}0>IPW-V CISC(Complex Instruction Set Computing,复杂指令集计算机)
; ,9:1.L CISC: Complex Instruction Set Computing(复杂指令结构)
XSOSy2: Clipping(剪贴纹理)
,9~=yC CLK(Clock Cycle,时钟周期)
+V
Oczl= Clock Synthesizer,时钟合成器
v0q(k;Ya CLV(Constant Linear Velocity,恒定线速度)
6~b)Hc/ CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
dQ#$(<v[ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
j; TXZ`|( CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
4 x|yzUx COB(Cache on board,板上集成缓存)
L*(Sh2=_ COB(Cache on board,板上集成缓存)
H;w8[ImK COD(Cache on Die,芯片内集成缓存)
FHOF6}if COD(Cache on Die,芯片内集成缓存)
XiW~?
*Z COM: Component Object Model(组件对象模式)
u7(<YSOs COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
-}x( MZ compressed textures(压缩纹理)
GUDz>( Concurrent Command Engine,协作命令引擎
!
mb<z^>5 COO(Chief Organizer Officer,首席管理官)
l~(A(1 CP: Ceramic Package(陶瓷封装)
" i!Xiy~ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
cZR9rnZT CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
4(nwi[1Y CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
@h=r;N#/`P CPS: Certification Practice Statement(使用证明书)
|X47&Y CPU(Center Processing Unit,中央处理器)
%^KNY ;E CPU: Centerl Processing Unit(中央处理器)
(ay((|) CPU:Center Processing Unit,中央处理器
5.M82rR;~ CRC: Cyclical Redundancy Check(循环冗余检查)
2e?a"Vss CRT(Cathode Ray Tube,阴极射线管)
Yx[B*] 2 CS(Channel Separation,声道分离)
3q-Xj:FP CSE(Configuration Space Enable,可分配空间)
BG/Q7s-?K CSS(Common Command Set,通用指令集)
i&mt- CSS: Cascading Style Sheets,层叠格式表
pOq9J7BS CTO(Chief Technology Officer,首席技术官)
)i/x%^ca$ CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
*G&3NSM- CTS(Clear to Send,清除发送)
2H,n"-9+ CVS(Compute Visual Syndrome,计算机视觉综合症)