作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
9M7(_E;)B 3DNow!(3D no waiting)
R;TEtu7 3DPA(3D Positional Audio,3D定位音频)
|gRgQGeB 3DS(3D SubSystem,三维子系统)
-IEP?NX ABS(Auto Balance System,自动平衡系统)
)x:j5{>( AC(Audio Codec,音频多媒体数字信号编解码器)
tj^:SW.0 ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
S_ -QvG2 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
};|PFWs AE(Atmospheric Effects,雾化效果)
sQw`U{JG AFR(Alternate Frame Rendering,交替渲染技术)
G>ptwB81KM AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
e9_O/i N AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
C8W`Oly:] AGU(Address Generation Units,地址产成单元)
AIxBZt7{b AH: Authentication Header,鉴定文件头
> v!c\ AHA(Accelerated Hub Architecture,加速中心架构)
BQ}.+T\ AL: Artificial Life(人工生命)
>wS:3$Q ALU(Arithmetic Logic Unit,算术逻辑单元)
E#2k|TpH4 AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
Qdr-GODx AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
-z 5k4Y Anisotropic Filtering(各向异性过滤)
.kKwdqO+zB API(Application Programming Interfaces,应用程序接口)
FPUR0myCU APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
L|1zHDxQ APM(Advanced Power Management,高级能源管理)
FqUt uN
APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
hHl-;%# ARP(Address Resolution Protocol,地址解析协议)
#HuA(``[d ASC(Anti Static Coatings,防静电涂层)
j]l}K*8( ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
Fee WZe0i ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
L,A-G"z0Z ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
6L> "m0 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
7@cvy?
v{ ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
\y )4`A ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
PLD'Q,R AST(Average Seek time,平均寻道时间)
)(!Z90@ ATA(AT Attachment,AT扩展型)
7CL@iL Tq ATAPI(AT Attachment Packet Interface)
g&F<Uv#mZ ATC(Access Time from Clock,时钟存取时间)
A{Htpm ~ ATL: ActiveX Template Library(ActiveX模板库)
V =aoB
Z ATM(Asynchronous Transfer Mode,异步传输模式)
Y7V&zF{ ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
_yB9/F ATX: AT Extend(扩展型AT)
BvW gH.OX Auxiliary Input(辅助输入接口)
>fj$wOq AV(Analog Video,模拟视频)
&|\}\+0Z AVI(Audio Video Interleave,音频视频插入)
Vv)E41
Back Buffer,后置缓冲
i[\u-TF Backface culling(隐面消除)
S@G{|. )2 BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
U8$dG)PhA Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
kmr
4cU5 BCF(Boot Catalog File,启动目录文件)
PM<LR?PLc Benchmarks:基准测试程序数值
ApJf4D<V BGA(Ball Grid Array,球状矩阵排列)
xOyL2 BGA(Ball Grid Array,球状矩阵排列)
P5xmLefng BGA: Ball Grid Array(球状网格阵列)
wYMX1= BHT(branch prediction table,分支预测表)
jzA8f+:q BIF(Boot Image File,启动映像文件)
r\ Yur Bilinear Filtering(双线性过滤)
>;r05,mc BIOS(Basic Input/Output System,基本输入/输出系统)
dlzamoS@AR BLA: Bearn Landing Area(电子束落区)
DD$Pr&~= BMC(Black Matrix Screen,超黑矩阵屏幕)
27 TZ+? BOD(Bandwidth On Demand,弹性带宽运用)
y^46z(I BOPS:Billion Operations Per Second,十亿次运算/秒
3R:i*8C bps(bit per second,位/秒)
<.(/#=2 BPU(Branch Processing Unit,分支处理单元)
z slEUTj) Brach Pediction(分支预测)
u&_U
CJCf BSD(Berkeley Software Distribution,伯克利软件分配代号)
@OY-(cW BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
0\ w[_H BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
*#^1rKGWK C2C: card-to-card interleaving,卡到卡交错存取
qq_,"~ CAD: computer-aided design,计算机辅助设计
)$4DH:WN CAM(Common Access Model,公共存取模型)
]a |;G CAS(Column Address Strobe,列地址控制器)
7c]Ai CBR(Committed Burst Rate,约定突发速率)
U@5Z9/n{ CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
UYrzsUjg& CCD(Charge Coupled Device,电荷连接设备)
C$ `Y[w CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
3 DHA^9<q CCM(Call Control Manager,拨号控制管理)
PQ"%Z.F" cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
D=sc41] CCS(Cut Change System)
j"u)/A8* CCT(Clock Cycle Time,时钟周期)
M>gZVB,eP> CDR(CD Recordable,可记录光盘)
T<?BIQz(} CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
+*{5ORq= CDRW(CD-Rewritable,可重复刻录光盘)
+mOtYfW CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
[IBk-opap CE(Consumer Electronics,消费电子)
KL"L65g& CEM(cube environment mapping,立方环境映射)
GiwA$^Hg\ Center Processing Unit Utilization,中央处理器占用率
_1c_TM h}9 CEO(Chief Executive Officer,首席执行官)
V"jnrNs3 CG(Computer Graphics,计算机生成图像)
TC{Qu;`H+U CGI(Common Gateway Interface,通用网关接口)
*+Q*&-$ CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
l{o{=]x1 CIEA: Commercial Internet Exchange Association,商业因特网交易协会
ykhCt\t[ CIR(Committed Infomation Rate,约定信息速率)
SY)$2RC+} CISC(Complex Instruction Set Computing,复杂指令集计算机)
[gp:nxyfQm CISC(Complex Instruction Set Computing,复杂指令集计算机)
Iw7r}G CISC: Complex Instruction Set Computing(复杂指令结构)
I8;[DP9 Clipping(剪贴纹理)
}V;]c~Q/H CLK(Clock Cycle,时钟周期)
K.1yncS^ Clock Synthesizer,时钟合成器
X )s7_ CLV(Constant Linear Velocity,恒定线速度)
*Y0,d`
CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
nnl9I4-O CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
O~'yP@&` CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
J\D3fh97- COB(Cache on board,板上集成缓存)
bu&y w~ COB(Cache on board,板上集成缓存)
X2?_lZ[\ COD(Cache on Die,芯片内集成缓存)
a`iAA1HJ COD(Cache on Die,芯片内集成缓存)
W(4?#lA2W COM: Component Object Model(组件对象模式)
" z'!il# COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
BQ0\+ compressed textures(压缩纹理)
R>&/n/l Concurrent Command Engine,协作命令引擎
M
F: Eu COO(Chief Organizer Officer,首席管理官)
0w. _}Cz CP: Ceramic Package(陶瓷封装)
{~I_rlo n CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
}3y\cv0ct CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
4yv31QG$ CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
RcP5].^T CPS: Certification Practice Statement(使用证明书)
q#3X*!) CPU(Center Processing Unit,中央处理器)
^(vd8 &71 CPU: Centerl Processing Unit(中央处理器)
A'(F%0NF6 CPU:Center Processing Unit,中央处理器
):ZumG#o CRC: Cyclical Redundancy Check(循环冗余检查)
oz@6%3+ CRT(Cathode Ray Tube,阴极射线管)
S9oGf CS(Channel Separation,声道分离)
S`w)b'B!M CSE(Configuration Space Enable,可分配空间)
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tQaj CSS(Common Command Set,通用指令集)
ZhaOH5{9 CSS: Cascading Style Sheets,层叠格式表
9'h^59 CTO(Chief Technology Officer,首席技术官)
D +""o"% CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
p,Hk"DSs% CTS(Clear to Send,清除发送)
<t37DnCgI CVS(Compute Visual Syndrome,计算机视觉综合症)