作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
v{1g`E 3DNow!(3D no waiting)
7:$dl# 3DPA(3D Positional Audio,3D定位音频)
$'#}f? 3DS(3D SubSystem,三维子系统)
:=q9ay ABS(Auto Balance System,自动平衡系统)
B<@a&QBTg AC(Audio Codec,音频多媒体数字信号编解码器)
MScUrW!TA ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
v33[Rk' ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
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ZkN6 AE(Atmospheric Effects,雾化效果)
` -W4/7 AFR(Alternate Frame Rendering,交替渲染技术)
V0#E7u`4 AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
'rfsrZ? AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
BTA2[' AGU(Address Generation Units,地址产成单元)
n*|8(fD AH: Authentication Header,鉴定文件头
1T,Bd!g AHA(Accelerated Hub Architecture,加速中心架构)
%>O}bdSf AL: Artificial Life(人工生命)
Xpkj44cd@ ALU(Arithmetic Logic Unit,算术逻辑单元)
>A6PH*x AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
%2G3+T8*x AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
%md9ou` Anisotropic Filtering(各向异性过滤)
% 1<@p%y/ API(Application Programming Interfaces,应用程序接口)
j6 _w2 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
]8cD, NS APM(Advanced Power Management,高级能源管理)
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C= APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
r|3u]rt ARP(Address Resolution Protocol,地址解析协议)
VWCC(YRU|$ ASC(Anti Static Coatings,防静电涂层)
bhZ5-wo4% ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
|NjyO>@Pa ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
wlP%
U ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
e6T?2`5P ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
lL'K1%{+
\ ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
dftX$TS ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
A>:31C AST(Average Seek time,平均寻道时间)
zFwO( ATA(AT Attachment,AT扩展型)
eo"XHP7ja ATAPI(AT Attachment Packet Interface)
&Fmen;( ATC(Access Time from Clock,时钟存取时间)
OXoEA a ATL: ActiveX Template Library(ActiveX模板库)
GsqO^SV ATM(Asynchronous Transfer Mode,异步传输模式)
$VxuaOTyVZ ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
aJ]t1 ATX: AT Extend(扩展型AT)
^#7&R" Auxiliary Input(辅助输入接口)
~~ty9;KYL AV(Analog Video,模拟视频)
^M1O) AVI(Audio Video Interleave,音频视频插入)
xkaed Back Buffer,后置缓冲
f+c{<fX Backface culling(隐面消除)
L#_QrR6Sny BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
<%`z:G3 Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
P[Vf$ q< BCF(Boot Catalog File,启动目录文件)
7 :u+-U Benchmarks:基准测试程序数值
yN}<l% BGA(Ball Grid Array,球状矩阵排列)
=G rg BGA(Ball Grid Array,球状矩阵排列)
lg jY\? BGA: Ball Grid Array(球状网格阵列)
Lg6>\Z4 BHT(branch prediction table,分支预测表)
kN vNV(4 BIF(Boot Image File,启动映像文件)
v[m1R' Bilinear Filtering(双线性过滤)
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ZI'q BIOS(Basic Input/Output System,基本输入/输出系统)
xz/G$7q7 BLA: Bearn Landing Area(电子束落区)
mj2sbRiSR= BMC(Black Matrix Screen,超黑矩阵屏幕)
ck`$ ` BOD(Bandwidth On Demand,弹性带宽运用)
Oo%%f+ BOPS:Billion Operations Per Second,十亿次运算/秒
u,@x7a,z bps(bit per second,位/秒)
XToYtdt2 BPU(Branch Processing Unit,分支处理单元)
<,nd]a Brach Pediction(分支预测)
7^h*rL9 BSD(Berkeley Software Distribution,伯克利软件分配代号)
D4+OWbf6 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
[rhK2fr:i BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
vRO`hGH C2C: card-to-card interleaving,卡到卡交错存取
O<0-`=W,a CAD: computer-aided design,计算机辅助设计
8O^z{Yh7 CAM(Common Access Model,公共存取模型)
}GGH:v CAS(Column Address Strobe,列地址控制器)
xSjs+Y;Mu CBR(Committed Burst Rate,约定突发速率)
sQY0Xys<4 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
X*:)]p(R CCD(Charge Coupled Device,电荷连接设备)
c5HW.3" CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
LS1}j WU! CCM(Call Control Manager,拨号控制管理)
Jz_`dLL^w cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
qI\B;&hr( CCS(Cut Change System)
V ;M'd@ CCT(Clock Cycle Time,时钟周期)
b=Q%Jxz? CDR(CD Recordable,可记录光盘)
YccD^w[`B CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
T:udw CDRW(CD-Rewritable,可重复刻录光盘)
N8]d0 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
SjU0Xb)[ CE(Consumer Electronics,消费电子)
rP&.`m88n CEM(cube environment mapping,立方环境映射)
N5fMMi(O Center Processing Unit Utilization,中央处理器占用率
oVnHbvP1X CEO(Chief Executive Officer,首席执行官)
`q1K%id CG(Computer Graphics,计算机生成图像)
ezk:XDi4 CGI(Common Gateway Interface,通用网关接口)
|F>'7JJJ CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
)XD$YI CIEA: Commercial Internet Exchange Association,商业因特网交易协会
rEZMX2 CIR(Committed Infomation Rate,约定信息速率)
hKp-" CISC(Complex Instruction Set Computing,复杂指令集计算机)
X57\sggK CISC(Complex Instruction Set Computing,复杂指令集计算机)
"1$hfs CISC: Complex Instruction Set Computing(复杂指令结构)
p\,PY Clipping(剪贴纹理)
sMb+4{W&6 CLK(Clock Cycle,时钟周期)
]3yaIlpD1 Clock Synthesizer,时钟合成器
>K;C?gHo CLV(Constant Linear Velocity,恒定线速度)
ljj}XJQ CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
:U#4H;kk~j CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
0o&7l%Y/ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
j&=!F3[ COB(Cache on board,板上集成缓存)
0GiL(e| COB(Cache on board,板上集成缓存)
lV<j?I~?Q COD(Cache on Die,芯片内集成缓存)
XiUae{j` COD(Cache on Die,芯片内集成缓存)
>c8EgSZJ COM: Component Object Model(组件对象模式)
>1d`G%KfG COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
,7|2K &C5 compressed textures(压缩纹理)
nSV
OS6 Concurrent Command Engine,协作命令引擎
PF/eQZ*4 COO(Chief Organizer Officer,首席管理官)
25`6V>\ CP: Ceramic Package(陶瓷封装)
(K->5rSU CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
^<'=]?xr CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
5ayH5=(t CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
Zo36jSrCL CPS: Certification Practice Statement(使用证明书)
^Zw1X6C5~ CPU(Center Processing Unit,中央处理器)
0N*~"j;r#M CPU: Centerl Processing Unit(中央处理器)
Yf,U2A\ CPU:Center Processing Unit,中央处理器
'|l1-yD_ CRC: Cyclical Redundancy Check(循环冗余检查)
q%GlS=o" CRT(Cathode Ray Tube,阴极射线管)
2=xjgK CS(Channel Separation,声道分离)
Ycve[31BDd CSE(Configuration Space Enable,可分配空间)
Ny)!uqul* CSS(Common Command Set,通用指令集)
FQCz_z CSS: Cascading Style Sheets,层叠格式表
'0>w_ge4 CTO(Chief Technology Officer,首席技术官)
2AI~Jm# CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
M2e_)f:
CTS(Clear to Send,清除发送)
'IroQ M CVS(Compute Visual Syndrome,计算机视觉综合症)