作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
'c\zWmAZ 3DNow!(3D no waiting)
EaG3:<>J 3DPA(3D Positional Audio,3D定位音频)
$6T*\(;T@A 3DS(3D SubSystem,三维子系统)
;$=`BI) ABS(Auto Balance System,自动平衡系统)
RZ9vQ\X
U) AC(Audio Codec,音频多媒体数字信号编解码器)
Hm4:m$=p4 ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
HiEXw}Hkz ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
Y!v `0z AE(Atmospheric Effects,雾化效果)
1"009/| AFR(Alternate Frame Rendering,交替渲染技术)
]FvN*@lG AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
Sb+pB58&N AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
H?8KTl=e AGU(Address Generation Units,地址产成单元)
r>sk@[4h AH: Authentication Header,鉴定文件头
iTi<X|X AHA(Accelerated Hub Architecture,加速中心架构)
]L%qfy4 AL: Artificial Life(人工生命)
J
(Yfup ALU(Arithmetic Logic Unit,算术逻辑单元)
EX7cjQsml AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
d {a^ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
>Qz#;HI Anisotropic Filtering(各向异性过滤)
1Dg\\aUk API(Application Programming Interfaces,应用程序接口)
|j$&W;yC APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
G*ZHLLO4S\ APM(Advanced Power Management,高级能源管理)
i2/:'
i APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
abUvU26t ARP(Address Resolution Protocol,地址解析协议)
(X@JlAfB ASC(Anti Static Coatings,防静电涂层)
Id(o6j^J_ ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
h #Od tc1) ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
8P0XY
S@ ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
ngj=w;7~+ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
*<#jr ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
&/}]9 # ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
^[Cpu_]D AST(Average Seek time,平均寻道时间)
G2U=*| ATA(AT Attachment,AT扩展型)
RyKsM. ATAPI(AT Attachment Packet Interface)
I.A7H'j ATC(Access Time from Clock,时钟存取时间)
*g]q~\b/; ATL: ActiveX Template Library(ActiveX模板库)
:XEP:8 ATM(Asynchronous Transfer Mode,异步传输模式)
r4k=i4 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
PuqT&|wP l ATX: AT Extend(扩展型AT)
DcE)6z# Auxiliary Input(辅助输入接口)
6uW?xB9 AV(Analog Video,模拟视频)
%+YLe-\? AVI(Audio Video Interleave,音频视频插入)
&WE| 9 Back Buffer,后置缓冲
+',[q Backface culling(隐面消除)
jt?4raNW BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
;3OQgKI Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
at]=SA BCF(Boot Catalog File,启动目录文件)
l7]:b8 Benchmarks:基准测试程序数值
}&Un8Rg"h BGA(Ball Grid Array,球状矩阵排列)
OF&{mJH"g' BGA(Ball Grid Array,球状矩阵排列)
#\[h.4i BGA: Ball Grid Array(球状网格阵列)
W\:!v%C BHT(branch prediction table,分支预测表)
orYE& BIF(Boot Image File,启动映像文件)
]l7) F-v Bilinear Filtering(双线性过滤)
Fxdu)F,~u BIOS(Basic Input/Output System,基本输入/输出系统)
A94ZG: BLA: Bearn Landing Area(电子束落区)
x1</%y5ev BMC(Black Matrix Screen,超黑矩阵屏幕)
?pn<lW8d BOD(Bandwidth On Demand,弹性带宽运用)
c""*Ng*T BOPS:Billion Operations Per Second,十亿次运算/秒
2K4Jkyi bps(bit per second,位/秒)
Xptb4] BPU(Branch Processing Unit,分支处理单元)
_^;+_6&[ Brach Pediction(分支预测)
$#4Qv5} BSD(Berkeley Software Distribution,伯克利软件分配代号)
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}$ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
xDU>y BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
(? j $n?p C2C: card-to-card interleaving,卡到卡交错存取
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G{ CAD: computer-aided design,计算机辅助设计
ms2y[b CAM(Common Access Model,公共存取模型)
`!WtKqr%B CAS(Column Address Strobe,列地址控制器)
]=\vl>W CBR(Committed Burst Rate,约定突发速率)
yW5/Y02 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
C4wJSQl_I CCD(Charge Coupled Device,电荷连接设备)
ya7PF~:E- CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
&<hDl<E CCM(Call Control Manager,拨号控制管理)
4j^-n_T cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
.XDY1~w0 CCS(Cut Change System)
&AM<H}> CCT(Clock Cycle Time,时钟周期)
`2N&{( CDR(CD Recordable,可记录光盘)
!wP|t#Sc9 CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
p|fSPSz CDRW(CD-Rewritable,可重复刻录光盘)
W <.h@Rz+ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
i4;`dCT|A CE(Consumer Electronics,消费电子)
eS)2#= CEM(cube environment mapping,立方环境映射)
7OuzQzhcK Center Processing Unit Utilization,中央处理器占用率
Tj5G
/H> CEO(Chief Executive Officer,首席执行官)
n.9k< CG(Computer Graphics,计算机生成图像)
8 Z|c!QIU CGI(Common Gateway Interface,通用网关接口)
qZw4"&,j$ CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
#m>Rt~(,S CIEA: Commercial Internet Exchange Association,商业因特网交易协会
Pf,S`Uw; CIR(Committed Infomation Rate,约定信息速率)
/8m2oL\< CISC(Complex Instruction Set Computing,复杂指令集计算机)
+LBDn"5 CISC(Complex Instruction Set Computing,复杂指令集计算机)
0zH^yx:ma CISC: Complex Instruction Set Computing(复杂指令结构)
)D_ZZPq_ Clipping(剪贴纹理)
fzcPi9+ CLK(Clock Cycle,时钟周期)
kg@D?VqJP Clock Synthesizer,时钟合成器
55lL aus CLV(Constant Linear Velocity,恒定线速度)
9gjI;*(z1 CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
2K >tI9); CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
9J>b6 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
u=j|']hp#& COB(Cache on board,板上集成缓存)
p#-ov-znp COB(Cache on board,板上集成缓存)
+Smt8O<N COD(Cache on Die,芯片内集成缓存)
D2hEI2S COD(Cache on Die,芯片内集成缓存)
<(|No3jx COM: Component Object Model(组件对象模式)
38Rod]\E COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
$E=t6WvA compressed textures(压缩纹理)
f1eY2UtWQ Concurrent Command Engine,协作命令引擎
%cIF() COO(Chief Organizer Officer,首席管理官)
do3 BI4Q CP: Ceramic Package(陶瓷封装)
.-kqt^Gc CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
E>_?9~8Mf CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
9a.r(W[9 CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
In1VW|4h CPS: Certification Practice Statement(使用证明书)
X`,4pSQ; CPU(Center Processing Unit,中央处理器)
NF?FEUoxz CPU: Centerl Processing Unit(中央处理器)
k:?+75?$ CPU:Center Processing Unit,中央处理器
`b(y 5 Z CRC: Cyclical Redundancy Check(循环冗余检查)
T9
@^@l$ CRT(Cathode Ray Tube,阴极射线管)
sy^k:y? CS(Channel Separation,声道分离)
re.%$D@ CSE(Configuration Space Enable,可分配空间)
G5^gwG+ CSS(Common Command Set,通用指令集)
m~K[+P CSS: Cascading Style Sheets,层叠格式表
GPqF> CTO(Chief Technology Officer,首席技术官)
m7:E73: CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
pB
@l+
n^ CTS(Clear to Send,清除发送)
!*46@sb: CVS(Compute Visual Syndrome,计算机视觉综合症)