作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
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5p 3DNow!(3D no waiting)
n2H&t>N 3DPA(3D Positional Audio,3D定位音频)
vxF:vI# @ 3DS(3D SubSystem,三维子系统)
EwC5[bRjUp ABS(Auto Balance System,自动平衡系统)
ya;@<b AC(Audio Codec,音频多媒体数字信号编解码器)
tP -5 ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
L,tZh0 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
u87=q^$ AE(Atmospheric Effects,雾化效果)
JB641nv AFR(Alternate Frame Rendering,交替渲染技术)
Z+OAs0}mV AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
T,A!5V>cX AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
o$*bm6o AGU(Address Generation Units,地址产成单元)
RT1{+:l AH: Authentication Header,鉴定文件头
-wJ AHA(Accelerated Hub Architecture,加速中心架构)
j'#)~>b AL: Artificial Life(人工生命)
D<lQoO+ ALU(Arithmetic Logic Unit,算术逻辑单元)
xq8}6Q AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
5+o
2 T] AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
GP0[Y Anisotropic Filtering(各向异性过滤)
xn0s`I[ API(Application Programming Interfaces,应用程序接口)
I3V{"Nx6 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
p`shYyE APM(Advanced Power Management,高级能源管理)
Pm;x]Aj APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
Vf@S8H ARP(Address Resolution Protocol,地址解析协议)
vsOdp:Yp9! ASC(Anti Static Coatings,防静电涂层)
~5x4?2 ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
W9:fKP ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
$K5ni {M; ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
7[(Lrx.pM ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
* [iity ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
`two|gX0K ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
IptB.bYc AST(Average Seek time,平均寻道时间)
o6`Y7,] ATA(AT Attachment,AT扩展型)
3RBpbTNWp ATAPI(AT Attachment Packet Interface)
N[- %0 ATC(Access Time from Clock,时钟存取时间)
nL "g2 3 ATL: ActiveX Template Library(ActiveX模板库)
kxt\{iy4 ATM(Asynchronous Transfer Mode,异步传输模式)
]Om'naD ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
~Rx~g ATX: AT Extend(扩展型AT)
BYhmJC| Auxiliary Input(辅助输入接口)
-6.i\
B AV(Analog Video,模拟视频)
{o Q(<&Aw AVI(Audio Video Interleave,音频视频插入)
Yg\{S<wr Back Buffer,后置缓冲
5]A$P\7~1 Backface culling(隐面消除)
P]~N-xdV BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
m^W*[^p Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
~N)( ^ 4 BCF(Boot Catalog File,启动目录文件)
(MF+/fi Benchmarks:基准测试程序数值
KqT#zj BGA(Ball Grid Array,球状矩阵排列)
W)G2Cs?p BGA(Ball Grid Array,球状矩阵排列)
}Rf}NWU)| BGA: Ball Grid Array(球状网格阵列)
,I9][_ BHT(branch prediction table,分支预测表)
Qivf|H619 BIF(Boot Image File,启动映像文件)
G.A=hGw Bilinear Filtering(双线性过滤)
SaX,^_GY BIOS(Basic Input/Output System,基本输入/输出系统)
lo IL{2 BLA: Bearn Landing Area(电子束落区)
v
Ie=wf~D` BMC(Black Matrix Screen,超黑矩阵屏幕)
bn^mL~ BOD(Bandwidth On Demand,弹性带宽运用)
-N /8Ho BOPS:Billion Operations Per Second,十亿次运算/秒
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bps(bit per second,位/秒)
"t3uW6& BPU(Branch Processing Unit,分支处理单元)
tal>b]B; Brach Pediction(分支预测)
$9LGdKZ_D BSD(Berkeley Software Distribution,伯克利软件分配代号)
B;Q`vKY BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
yoq\9* ?u^ BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
F:[Nw#gj/ C2C: card-to-card interleaving,卡到卡交错存取
%RfY`n CAD: computer-aided design,计算机辅助设计
P>yG/:W; CAM(Common Access Model,公共存取模型)
Zi2Eu4p l{ CAS(Column Address Strobe,列地址控制器)
=H.<"7 CBR(Committed Burst Rate,约定突发速率)
nm{'HH-4 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
\FY/eQ*07 CCD(Charge Coupled Device,电荷连接设备)
+R{A'Yl[( CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
0XBBA0tq CCM(Call Control Manager,拨号控制管理)
E.zYi7YUKK cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
XZUB*P}]D CCS(Cut Change System)
y{&{=1# CCT(Clock Cycle Time,时钟周期)
Y%n{`9= CDR(CD Recordable,可记录光盘)
)sqp7["- CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
: pE-{3I CDRW(CD-Rewritable,可重复刻录光盘)
+Tgy,oD0 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
i4{ / CE(Consumer Electronics,消费电子)
H`+]dXLB CEM(cube environment mapping,立方环境映射)
r-1yJ Center Processing Unit Utilization,中央处理器占用率
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hJncc CEO(Chief Executive Officer,首席执行官)
A$H+4L CG(Computer Graphics,计算机生成图像)
gavQb3EP CGI(Common Gateway Interface,通用网关接口)
p3,(*eZ CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
n;S0fg CIEA: Commercial Internet Exchange Association,商业因特网交易协会
eY6gb!5u CIR(Committed Infomation Rate,约定信息速率)
@SF")j| CISC(Complex Instruction Set Computing,复杂指令集计算机)
^-csi CISC(Complex Instruction Set Computing,复杂指令集计算机)
/:*R -VdF CISC: Complex Instruction Set Computing(复杂指令结构)
n##w[7B* Clipping(剪贴纹理)
"W,"qFx CLK(Clock Cycle,时钟周期)
?h>%Ix Clock Synthesizer,时钟合成器
.5Z,SGBf CLV(Constant Linear Velocity,恒定线速度)
H$=h- CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
pDq^W@Rq CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
b3y,4ke" CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
8`rAE_n`% COB(Cache on board,板上集成缓存)
i no7!T` COB(Cache on board,板上集成缓存)
5sA>O2Rt> COD(Cache on Die,芯片内集成缓存)
{3F}Slb COD(Cache on Die,芯片内集成缓存)
Muc*?wB` COM: Component Object Model(组件对象模式)
]/<Qn-BbU COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
mTb2d?NS compressed textures(压缩纹理)
G}9bCr, Concurrent Command Engine,协作命令引擎
Zo}\gg3 COO(Chief Organizer Officer,首席管理官)
.LGkr@P CP: Ceramic Package(陶瓷封装)
fd,}YAiX CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
6f5sIg CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
=5s~$C CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
D/!eov4" CPS: Certification Practice Statement(使用证明书)
Js^r]=\F' CPU(Center Processing Unit,中央处理器)
@Z=y'yc'y. CPU: Centerl Processing Unit(中央处理器)
-67f33 CPU:Center Processing Unit,中央处理器
{_k!!p6 CRC: Cyclical Redundancy Check(循环冗余检查)
7Da^Jv k CRT(Cathode Ray Tube,阴极射线管)
Tg{dIh.Q~O CS(Channel Separation,声道分离)
n)wpxR CSE(Configuration Space Enable,可分配空间)
#IL~0t CSS(Common Command Set,通用指令集)
)n3biQL_ CSS: Cascading Style Sheets,层叠格式表
4%c7#AX[T CTO(Chief Technology Officer,首席技术官)
2!~>)N CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
Y+PvL|`O CTS(Clear to Send,清除发送)
?SsRN jeL CVS(Compute Visual Syndrome,计算机视觉综合症)