作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
He^+>XIam 3DNow!(3D no waiting)
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7 3DPA(3D Positional Audio,3D定位音频)
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#u1.|s&p 3DS(3D SubSystem,三维子系统)
(o)nN8 ABS(Auto Balance System,自动平衡系统)
-MOPm]iA AC(Audio Codec,音频多媒体数字信号编解码器)
zI8Q "b ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
D{I^_~-\5 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
]Gm,sp.x AE(Atmospheric Effects,雾化效果)
d$8rzd AFR(Alternate Frame Rendering,交替渲染技术)
7g}4gX's AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
iq-n(Rfw~ AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
n?_!gqK AGU(Address Generation Units,地址产成单元)
rcMVYSj0 AH: Authentication Header,鉴定文件头
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nY<J AHA(Accelerated Hub Architecture,加速中心架构)
GiJ|5" AL: Artificial Life(人工生命)
Q\&FuU ALU(Arithmetic Logic Unit,算术逻辑单元)
@|(mR-Jj AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
P;bl+a'gu AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
y _M<\b Anisotropic Filtering(各向异性过滤)
#P=rP= API(Application Programming Interfaces,应用程序接口)
j0^~="p%C APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
su/l'p' APM(Advanced Power Management,高级能源管理)
CdlE"Ye APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
VlRN ARP(Address Resolution Protocol,地址解析协议)
)+RTA
y [k ASC(Anti Static Coatings,防静电涂层)
?Q[uIQ?dV ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
f;`pj`-k% ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
]]`hnzJX ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
8<t6_* f ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
gN1b?_g ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
)a.Y$![ ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
K#H}=Y A AST(Average Seek time,平均寻道时间)
z:-a7_ ATA(AT Attachment,AT扩展型)
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[2@Wg ATAPI(AT Attachment Packet Interface)
'Dv
`Gj ATC(Access Time from Clock,时钟存取时间)
{[hH:
\ ATL: ActiveX Template Library(ActiveX模板库)
evNo(U\C ATM(Asynchronous Transfer Mode,异步传输模式)
I>o+INb: ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
\{@s@VBx[ ATX: AT Extend(扩展型AT)
>J^bs &j Auxiliary Input(辅助输入接口)
>[B}eS> AV(Analog Video,模拟视频)
^5j| AVI(Audio Video Interleave,音频视频插入)
2s>dlz Back Buffer,后置缓冲
*,5V;7OR Backface culling(隐面消除)
rCi7q]_ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
N ncur] Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
ewg&DBbN" BCF(Boot Catalog File,启动目录文件)
r/'9@oM Benchmarks:基准测试程序数值
CdgZq\ BGA(Ball Grid Array,球状矩阵排列)
%l%5Q;t BGA(Ball Grid Array,球状矩阵排列)
vJVL%,7 BGA: Ball Grid Array(球状网格阵列)
L&ySXc= BHT(branch prediction table,分支预测表)
/2pf*\u BIF(Boot Image File,启动映像文件)
X>:@`}bq Bilinear Filtering(双线性过滤)
}NW^?37 BIOS(Basic Input/Output System,基本输入/输出系统)
S`gUSYS"w BLA: Bearn Landing Area(电子束落区)
IJ2 ]2FI BMC(Black Matrix Screen,超黑矩阵屏幕)
/fbI4&SB! BOD(Bandwidth On Demand,弹性带宽运用)
#\KSv
Z BOPS:Billion Operations Per Second,十亿次运算/秒
eBX#^ bps(bit per second,位/秒)
.ii9-+_ BPU(Branch Processing Unit,分支处理单元)
m6tbN/EJZ Brach Pediction(分支预测)
< gB>j\: BSD(Berkeley Software Distribution,伯克利软件分配代号)
2.CjjI BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
7yo/sb9h BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
l?v`kAMR C2C: card-to-card interleaving,卡到卡交错存取
EM!# FJh CAD: computer-aided design,计算机辅助设计
Q1J./C} CAM(Common Access Model,公共存取模型)
aKXaor@0f. CAS(Column Address Strobe,列地址控制器)
&S}%)g%Iv9 CBR(Committed Burst Rate,约定突发速率)
lMz5))Rr CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
i*B@#;;F CCD(Charge Coupled Device,电荷连接设备)
?nJ7lLQA CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
2*Hw6@Jj CCM(Call Control Manager,拨号控制管理)
a)=WDRk cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
|6w.m<p CCS(Cut Change System)
)k@W6N CCT(Clock Cycle Time,时钟周期)
2-5AKm@K CDR(CD Recordable,可记录光盘)
H6(kxpOI\ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
UOHU1.3$T CDRW(CD-Rewritable,可重复刻录光盘)
Z3?,r[ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
X{zg-k(@ CE(Consumer Electronics,消费电子)
XlIRedZ{ CEM(cube environment mapping,立方环境映射)
7_C;- Center Processing Unit Utilization,中央处理器占用率
3kFSu CEO(Chief Executive Officer,首席执行官)
w6DK&@w`'/ CG(Computer Graphics,计算机生成图像)
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KLr; CGI(Common Gateway Interface,通用网关接口)
EM]~yn!+ CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
?#?[6t CIEA: Commercial Internet Exchange Association,商业因特网交易协会
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\i0y5n CIR(Committed Infomation Rate,约定信息速率)
wEL$QOu$ CISC(Complex Instruction Set Computing,复杂指令集计算机)
834(kw+#9 CISC(Complex Instruction Set Computing,复杂指令集计算机)
Q<W9<&VZe CISC: Complex Instruction Set Computing(复杂指令结构)
>yFEUD: Clipping(剪贴纹理)
!]1X0wo\ CLK(Clock Cycle,时钟周期)
(,1}P Clock Synthesizer,时钟合成器
{;0j9rr CLV(Constant Linear Velocity,恒定线速度)
YfL|FsCh CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
1;cV [&3 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
sPY*2B CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
vWY}+# COB(Cache on board,板上集成缓存)
Su`LB z" COB(Cache on board,板上集成缓存)
CqX2R:# COD(Cache on Die,芯片内集成缓存)
9z7^0Ruw COD(Cache on Die,芯片内集成缓存)
54~`8f COM: Component Object Model(组件对象模式)
csE 9Ns COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
"+3p??h%Rq compressed textures(压缩纹理)
V_f}Y8>e Concurrent Command Engine,协作命令引擎
92_F8y*D COO(Chief Organizer Officer,首席管理官)
p'UY Ht CP: Ceramic Package(陶瓷封装)
V\^rs41$; CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
[^xLK CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
'teToE<i CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
>B(%$jG Z CPS: Certification Practice Statement(使用证明书)
, f9V`Pz) CPU(Center Processing Unit,中央处理器)
*Wk y# CPU: Centerl Processing Unit(中央处理器)
bOjvrg;Sz\ CPU:Center Processing Unit,中央处理器
kG_ K &,;@ CRC: Cyclical Redundancy Check(循环冗余检查)
a@ `1 5O: CRT(Cathode Ray Tube,阴极射线管)
Sx)b~ * CS(Channel Separation,声道分离)
fkE4[X7f CSE(Configuration Space Enable,可分配空间)
~qQSt% CSS(Common Command Set,通用指令集)
cPA-EH CSS: Cascading Style Sheets,层叠格式表
[uK*=K/v CTO(Chief Technology Officer,首席技术官)
tdSy&]P CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
A6ipA/_ CTS(Clear to Send,清除发送)
J'^H@L/E CVS(Compute Visual Syndrome,计算机视觉综合症)