作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
|H+k?C-w 3DNow!(3D no waiting)
LnRi+n[@7 3DPA(3D Positional Audio,3D定位音频)
A]SB c2 3DS(3D SubSystem,三维子系统)
s!o<Pd yJK ABS(Auto Balance System,自动平衡系统)
X $9D0;L AC(Audio Codec,音频多媒体数字信号编解码器)
RSWB!- ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
48&KdbGX ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
fssL'DD AE(Atmospheric Effects,雾化效果)
4KSP81}/\ AFR(Alternate Frame Rendering,交替渲染技术)
I|3v&E1 AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
T\e)Czz2- AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
WfjUJw5x"s AGU(Address Generation Units,地址产成单元)
o%~K4 M". AH: Authentication Header,鉴定文件头
kDpZnXP AHA(Accelerated Hub Architecture,加速中心架构)
:J4C'N AL: Artificial Life(人工生命)
)r|zi
Z {F ALU(Arithmetic Logic Unit,算术逻辑单元)
#:\+7mCF AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
J*lYH]s AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
MTITIecw= Anisotropic Filtering(各向异性过滤)
Mi/'4~0Y API(Application Programming Interfaces,应用程序接口)
GLKN<2|2@y APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
5W]N]^v APM(Advanced Power Management,高级能源管理)
f$@". APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
\$HB~u%dr ARP(Address Resolution Protocol,地址解析协议)
!{~7 )iq ASC(Anti Static Coatings,防静电涂层)
l& ^B ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
@n;YF5 ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
1d@^,7MF- ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
J>|:T ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
f?<M3P ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
$E~Lu$| ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
CL}I:/zRB AST(Average Seek time,平均寻道时间)
n$![b_)* ATA(AT Attachment,AT扩展型)
DwrCysIK ATAPI(AT Attachment Packet Interface)
'm!11Phe ATC(Access Time from Clock,时钟存取时间)
R?9Plzt5 ATL: ActiveX Template Library(ActiveX模板库)
WlLZtgq ATM(Asynchronous Transfer Mode,异步传输模式)
lSbM)gL ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
zQ|x>3 ATX: AT Extend(扩展型AT)
U/&qV"Ih Auxiliary Input(辅助输入接口)
VQNH@g^gqr AV(Analog Video,模拟视频)
D>x'3WYR AVI(Audio Video Interleave,音频视频插入)
T#^6u) Back Buffer,后置缓冲
"KTnX#<0 Backface culling(隐面消除)
{FmFu$z+[ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
u/:Sf*;? Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
"vRqtEBO@ BCF(Boot Catalog File,启动目录文件)
gMK3o8B/ Benchmarks:基准测试程序数值
#/v_h6$ BGA(Ball Grid Array,球状矩阵排列)
nu9k{owB T BGA(Ball Grid Array,球状矩阵排列)
e4W];7_K! BGA: Ball Grid Array(球状网格阵列)
ZE(RvPW BHT(branch prediction table,分支预测表)
i K[8At"Xo BIF(Boot Image File,启动映像文件)
B)cb}.N: Bilinear Filtering(双线性过滤)
[c!vsh]^ BIOS(Basic Input/Output System,基本输入/输出系统)
iIEIGQx BLA: Bearn Landing Area(电子束落区)
S+xGHi) BMC(Black Matrix Screen,超黑矩阵屏幕)
vAhO!5]>\ BOD(Bandwidth On Demand,弹性带宽运用)
Gc!{%x BOPS:Billion Operations Per Second,十亿次运算/秒
L2O57rT2 bps(bit per second,位/秒)
4aGpKvW BPU(Branch Processing Unit,分支处理单元)
rHdP4: n Brach Pediction(分支预测)
WI4_4 BSD(Berkeley Software Distribution,伯克利软件分配代号)
S"A_TH BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
.p0n\$r BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
d\Z4?@T<5 C2C: card-to-card interleaving,卡到卡交错存取
lRK?%~ CAD: computer-aided design,计算机辅助设计
sF3
l##Wv CAM(Common Access Model,公共存取模型)
PWD]qtr CAS(Column Address Strobe,列地址控制器)
:8L61d2( CBR(Committed Burst Rate,约定突发速率)
MmX[xk CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
R]sjG< CCD(Charge Coupled Device,电荷连接设备)
GQ)cUrXQz CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
m)RxV@ CCM(Call Control Manager,拨号控制管理)
b2f2WY |z> cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
VM|)\?Q CCS(Cut Change System)
.MPOUo/e CCT(Clock Cycle Time,时钟周期)
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p[VCt" j CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
EGr5xR- CDRW(CD-Rewritable,可重复刻录光盘)
k+G4<qw CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
vlyNQ7"% CE(Consumer Electronics,消费电子)
CKt~#$ I% CEM(cube environment mapping,立方环境映射)
h?tV>x/Fu Center Processing Unit Utilization,中央处理器占用率
VzM@DM]= ~ CEO(Chief Executive Officer,首席执行官)
vgZPDf| CG(Computer Graphics,计算机生成图像)
p;Ok.cXVp CGI(Common Gateway Interface,通用网关接口)
0 S8{VZpy CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
!3M!p& CIEA: Commercial Internet Exchange Association,商业因特网交易协会
95&sFT
C CIR(Committed Infomation Rate,约定信息速率)
J
2~B<=V CISC(Complex Instruction Set Computing,复杂指令集计算机)
l+X^x%EA CISC(Complex Instruction Set Computing,复杂指令集计算机)
Sh6 NgO CISC: Complex Instruction Set Computing(复杂指令结构)
a#GqJ?nY Clipping(剪贴纹理)
Z$K%@q,10+ CLK(Clock Cycle,时钟周期)
"Ksd9,J\b Clock Synthesizer,时钟合成器
!m5\w> CLV(Constant Linear Velocity,恒定线速度)
`CouP-g. CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
.z7f_KX^ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
pnb$lpxt CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
FsZEB/c COB(Cache on board,板上集成缓存)
sh3}0u+ COB(Cache on board,板上集成缓存)
Ec/+ 9H6g COD(Cache on Die,芯片内集成缓存)
BU\NBvX$ COD(Cache on Die,芯片内集成缓存)
JkEQ@x COM: Component Object Model(组件对象模式)
-;.fU44O[# COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
}(O
kl1 compressed textures(压缩纹理)
1L9
<1 Concurrent Command Engine,协作命令引擎
EHJc*WFPU- COO(Chief Organizer Officer,首席管理官)
iv`-)UsE CP: Ceramic Package(陶瓷封装)
au~gJW- CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
S?WUSx*N CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
[beuDZA CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
,\RC gc CPS: Certification Practice Statement(使用证明书)
S%|'
/cFo CPU(Center Processing Unit,中央处理器)
sW`iXsbWM> CPU: Centerl Processing Unit(中央处理器)
k)_#u;qmG CPU:Center Processing Unit,中央处理器
Y mSaIf CRC: Cyclical Redundancy Check(循环冗余检查)
2uB26SEIl CRT(Cathode Ray Tube,阴极射线管)
Ps,w(k{d CS(Channel Separation,声道分离)
t?&ajh CSE(Configuration Space Enable,可分配空间)
*g.,[a0 CSS(Common Command Set,通用指令集)
CA~S$H\" CSS: Cascading Style Sheets,层叠格式表
> _) a7% CTO(Chief Technology Officer,首席技术官)
\05C'z3] CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
KA[Su0 CTS(Clear to Send,清除发送)
~z"->.u CVS(Compute Visual Syndrome,计算机视觉综合症)