作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
~<VxtcEBz 3DNow!(3D no waiting)
-`\rDPGf 3DPA(3D Positional Audio,3D定位音频)
H6 x 3DS(3D SubSystem,三维子系统)
T&pCLvkz ABS(Auto Balance System,自动平衡系统)
oydP}X AC(Audio Codec,音频多媒体数字信号编解码器)
=&UE67eK, ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
JnK<:]LcK ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
IP#vfM AE(Atmospheric Effects,雾化效果)
Ii[U% AFR(Alternate Frame Rendering,交替渲染技术)
`&q+ f+z AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
{u1|`=; AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
Lr*PbjQDIY AGU(Address Generation Units,地址产成单元)
:K2
X~Ty AH: Authentication Header,鉴定文件头
$#D#ezvxe AHA(Accelerated Hub Architecture,加速中心架构)
~"`e9Im AL: Artificial Life(人工生命)
hjg1By( ALU(Arithmetic Logic Unit,算术逻辑单元)
.p e3L7g AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
Q34u>VkdQI AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
gF)-Ci Anisotropic Filtering(各向异性过滤)
`f~bnL API(Application Programming Interfaces,应用程序接口)
j`.&4.7+ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
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f-hI APM(Advanced Power Management,高级能源管理)
G2I%^.s APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
3R%JmLM+R9 ARP(Address Resolution Protocol,地址解析协议)
w(ZZTVW- ASC(Anti Static Coatings,防静电涂层)
R)Mkt8v ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
O[MFp ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
RNB&!NC
ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
}9\6!GY0 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
61kSCu ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
BI)C\D3[ ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
i&6U5Va,G AST(Average Seek time,平均寻道时间)
vPYHM2 ATA(AT Attachment,AT扩展型)
%4!^AA% ATAPI(AT Attachment Packet Interface)
#*CMf.OCh ATC(Access Time from Clock,时钟存取时间)
^ei[1# ATL: ActiveX Template Library(ActiveX模板库)
S5>ztK.e ATM(Asynchronous Transfer Mode,异步传输模式)
sd%)g<t ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
X+A@//,7 ATX: AT Extend(扩展型AT)
8h=m()Eu Auxiliary Input(辅助输入接口)
oZY|o0/9 AV(Analog Video,模拟视频)
Ss5@ n AVI(Audio Video Interleave,音频视频插入)
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>TU Back Buffer,后置缓冲
\ [[xyd Backface culling(隐面消除)
0g:q%P0 BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
}1 qQ7}v Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
(n B[aM BCF(Boot Catalog File,启动目录文件)
tb~E.Lm\ Benchmarks:基准测试程序数值
v4|TQ8!wR BGA(Ball Grid Array,球状矩阵排列)
$nmt&lm BGA(Ball Grid Array,球状矩阵排列)
+jB; BGA: Ball Grid Array(球状网格阵列)
_w?!Mu BHT(branch prediction table,分支预测表)
bv]SR_Tiq BIF(Boot Image File,启动映像文件)
nrev!h Bilinear Filtering(双线性过滤)
aB;f*x BIOS(Basic Input/Output System,基本输入/输出系统)
s1cu5eCt BLA: Bearn Landing Area(电子束落区)
\w1XOm [) BMC(Black Matrix Screen,超黑矩阵屏幕)
`x
_(EZ BOD(Bandwidth On Demand,弹性带宽运用)
Psx"[2iZm BOPS:Billion Operations Per Second,十亿次运算/秒
NCi~. I bps(bit per second,位/秒)
>&+V[srfD BPU(Branch Processing Unit,分支处理单元)
LBD],Ba! Brach Pediction(分支预测)
Jb*QlsGd BSD(Berkeley Software Distribution,伯克利软件分配代号)
%p)&mYK{ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
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p%+` BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
gkxHfm C2C: card-to-card interleaving,卡到卡交错存取
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=f= CAD: computer-aided design,计算机辅助设计
\f4rA?+f CAM(Common Access Model,公共存取模型)
4bL *7bA CAS(Column Address Strobe,列地址控制器)
*\'t$se+ CBR(Committed Burst Rate,约定突发速率)
uQ_C<ii"W CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
s&VsK# CCD(Charge Coupled Device,电荷连接设备)
7/hn%obC CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
YL|)`m0-^5 CCM(Call Control Manager,拨号控制管理)
084Us
s cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
T<Xw[PEnP CCS(Cut Change System)
u4
es8" CCT(Clock Cycle Time,时钟周期)
1\@PrO35J CDR(CD Recordable,可记录光盘)
].J;8} CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
Am@Ta "2 CDRW(CD-Rewritable,可重复刻录光盘)
!`Kg&t [&V CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
tc`3-goX CE(Consumer Electronics,消费电子)
4s:M}=]N CEM(cube environment mapping,立方环境映射)
yN`hW&K Center Processing Unit Utilization,中央处理器占用率
!YGHJwW: CEO(Chief Executive Officer,首席执行官)
N5zWeFq@6 CG(Computer Graphics,计算机生成图像)
up['<Kt+a CGI(Common Gateway Interface,通用网关接口)
L$O\fhO? CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
^ICSh8C CIEA: Commercial Internet Exchange Association,商业因特网交易协会
h&L-G j CIR(Committed Infomation Rate,约定信息速率)
)_C>hWvo_ CISC(Complex Instruction Set Computing,复杂指令集计算机)
8k:^( kByF CISC(Complex Instruction Set Computing,复杂指令集计算机)
!$1qnsz CISC: Complex Instruction Set Computing(复杂指令结构)
<h9nt4F Clipping(剪贴纹理)
baG_7>Q9H CLK(Clock Cycle,时钟周期)
.up[wt gN Clock Synthesizer,时钟合成器
U'F}k0h?\' CLV(Constant Linear Velocity,恒定线速度)
dO2?&f CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
<S7SH-{_\ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
.^=I&X/P CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
en{p<]H COB(Cache on board,板上集成缓存)
bs\kb-\R COB(Cache on board,板上集成缓存)
bK#ZY COD(Cache on Die,芯片内集成缓存)
qgl-,3GY%N COD(Cache on Die,芯片内集成缓存)
!4+Die X COM: Component Object Model(组件对象模式)
{G vGV COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
lq53
xT compressed textures(压缩纹理)
&D[M<7T Concurrent Command Engine,协作命令引擎
3YLfh`6 COO(Chief Organizer Officer,首席管理官)
g)Hsd0 CP: Ceramic Package(陶瓷封装)
Dx /w&v CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
tgCp2`n CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
9*FA=E CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
)vOBF5 CPS: Certification Practice Statement(使用证明书)
%K3U`6kHcd CPU(Center Processing Unit,中央处理器)
XQ[\K6X5 CPU: Centerl Processing Unit(中央处理器)
] H;E(1iU CPU:Center Processing Unit,中央处理器
@BnK C&{ CRC: Cyclical Redundancy Check(循环冗余检查)
NVkYm+J# CRT(Cathode Ray Tube,阴极射线管)
6<\dQ+~ CS(Channel Separation,声道分离)
rMJ@oc CSE(Configuration Space Enable,可分配空间)
~.^:?yCA CSS(Common Command Set,通用指令集)
m=E/um[D CSS: Cascading Style Sheets,层叠格式表
:kI[Pf!z CTO(Chief Technology Officer,首席技术官)
X4:84 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
jbe:"Stw CTS(Clear to Send,清除发送)
JE:LA+ ( CVS(Compute Visual Syndrome,计算机视觉综合症)