作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
~//E'V- 3DNow!(3D no waiting)
Sqb>aj 3DPA(3D Positional Audio,3D定位音频)
`:V'E>B 3DS(3D SubSystem,三维子系统)
^GY^g-R ABS(Auto Balance System,自动平衡系统)
ov,s]g83 AC(Audio Codec,音频多媒体数字信号编解码器)
:" !Z9l\@ ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
l:UKU ! ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
XL.f`N.O AE(Atmospheric Effects,雾化效果)
Um4zI> AFR(Alternate Frame Rendering,交替渲染技术)
.Hqq!& AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
FP=-
jf/ AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
DH+kp$,} AGU(Address Generation Units,地址产成单元)
i)X~L4gn AH: Authentication Header,鉴定文件头
&Y=~j?~Xm AHA(Accelerated Hub Architecture,加速中心架构)
SF-"3M AL: Artificial Life(人工生命)
1Xm>nF~ ALU(Arithmetic Logic Unit,算术逻辑单元)
0'pB7^y AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
]7W!f 2@ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
DAWF
=p] Anisotropic Filtering(各向异性过滤)
q 9xA.* API(Application Programming Interfaces,应用程序接口)
^#Q-?O APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
V^[&4 APM(Advanced Power Management,高级能源管理)
"ckK{kS4~ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
wW\@^5 ARP(Address Resolution Protocol,地址解析协议)
P*
0kz@ ASC(Anti Static Coatings,防静电涂层)
L f"!:] ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
[y'blCb ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
N'EZJoH ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
U- 1UWq ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
!fn%Q'S ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
H<i!C|AF ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
!10/M AST(Average Seek time,平均寻道时间)
rmkBp_i{| ATA(AT Attachment,AT扩展型)
K\U`gTGc ATAPI(AT Attachment Packet Interface)
IMqe( ATC(Access Time from Clock,时钟存取时间)
CA`V)XIsP ATL: ActiveX Template Library(ActiveX模板库)
GyQFR ? ATM(Asynchronous Transfer Mode,异步传输模式)
Q?>r:vMi ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
:+jg311} ATX: AT Extend(扩展型AT)
N^[
F+y Auxiliary Input(辅助输入接口)
-%fj-Y7y AV(Analog Video,模拟视频)
o<!H/PN AVI(Audio Video Interleave,音频视频插入)
ZOV,yuD{8{ Back Buffer,后置缓冲
[}HPV+j=U Backface culling(隐面消除)
Kj
@<$ChZw BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
V9"R8*@- Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
_%2ukuJ ` BCF(Boot Catalog File,启动目录文件)
Fik;hB Benchmarks:基准测试程序数值
A)n_ST0 BGA(Ball Grid Array,球状矩阵排列)
e7xv~C>g BGA(Ball Grid Array,球状矩阵排列)
w@,p` BGA: Ball Grid Array(球状网格阵列)
M]{~T7n- BHT(branch prediction table,分支预测表)
d<j`=QH BIF(Boot Image File,启动映像文件)
B(s^(__] Bilinear Filtering(双线性过滤)
{z
5YJ*C BIOS(Basic Input/Output System,基本输入/输出系统)
PV~D; BLA: Bearn Landing Area(电子束落区)
,iao56`E BMC(Black Matrix Screen,超黑矩阵屏幕)
au50%sA~
BOD(Bandwidth On Demand,弹性带宽运用)
w" [T BOPS:Billion Operations Per Second,十亿次运算/秒
lJFy(^KQG, bps(bit per second,位/秒)
<CO_JWD BPU(Branch Processing Unit,分支处理单元)
eJ45:]_%I@ Brach Pediction(分支预测)
DQW)^j
h BSD(Berkeley Software Distribution,伯克利软件分配代号)
D
)`(b BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
T:{&eWH BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
&)Qq%\EP4 C2C: card-to-card interleaving,卡到卡交错存取
v?]a tb/h` CAD: computer-aided design,计算机辅助设计
*\'t$se+ CAM(Common Access Model,公共存取模型)
@hA`f4^ CAS(Column Address Strobe,列地址控制器)
Ip7#${f5M CBR(Committed Burst Rate,约定突发速率)
"!vY{9, CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
n!Y_SPg
CCD(Charge Coupled Device,电荷连接设备)
v+{{j|x= CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
ELnUpmv\ CCM(Call Control Manager,拨号控制管理)
$k&v
juB. cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
VV1sadS:S` CCS(Cut Change System)
&D{!zF CCT(Clock Cycle Time,时钟周期)
ZlC+DXg#S CDR(CD Recordable,可记录光盘)
Hm'fK$y( CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
"TaLvworb4 CDRW(CD-Rewritable,可重复刻录光盘)
*8,W$pe3 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
B`R@%US CE(Consumer Electronics,消费电子)
9kWI2cLzQt CEM(cube environment mapping,立方环境映射)
)N- '~<N Center Processing Unit Utilization,中央处理器占用率
64U|]gd$ CEO(Chief Executive Officer,首席执行官)
!?ZR_=Y% CG(Computer Graphics,计算机生成图像)
?+d{Rh)y CGI(Common Gateway Interface,通用网关接口)
>i CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
8k:^( kByF CIEA: Commercial Internet Exchange Association,商业因特网交易协会
7NT}
Zwf CIR(Committed Infomation Rate,约定信息速率)
9jf9u0 CISC(Complex Instruction Set Computing,复杂指令集计算机)
5L2j,] CISC(Complex Instruction Set Computing,复杂指令集计算机)
{"~[F 2qR CISC: Complex Instruction Set Computing(复杂指令结构)
D1-w>Y# Clipping(剪贴纹理)
9[VYd ' CLK(Clock Cycle,时钟周期)
iP9]b& Clock Synthesizer,时钟合成器
iT{4-j7|P4 CLV(Constant Linear Velocity,恒定线速度)
j~\FDcG*ed CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
YC 4c-M CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
k?Hi_;o CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
-6-rXD COB(Cache on board,板上集成缓存)
nkPlfH COB(Cache on board,板上集成缓存)
+pT;;
9 COD(Cache on Die,芯片内集成缓存)
ejR$N!LL COD(Cache on Die,芯片内集成缓存)
9HN&M*} COM: Component Object Model(组件对象模式)
yO8@ .-j b COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
]6v7iuvI compressed textures(压缩纹理)
LC=M{\ Concurrent Command Engine,协作命令引擎
I&15[:b=- COO(Chief Organizer Officer,首席管理官)
r`FTiPD.C CP: Ceramic Package(陶瓷封装)
7W},5c CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
J:uFQWxZ
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
jl7> CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
/-lW$.+{? CPS: Certification Practice Statement(使用证明书)
zBTxM CPU(Center Processing Unit,中央处理器)
3VMaD@nYa CPU: Centerl Processing Unit(中央处理器)
_]'kw [ CPU:Center Processing Unit,中央处理器
U<XfO'XJ CRC: Cyclical Redundancy Check(循环冗余检查)
GfP' CRT(Cathode Ray Tube,阴极射线管)
*j,noHUT~> CS(Channel Separation,声道分离)
N!?~Dgw CSE(Configuration Space Enable,可分配空间)
&~.|9P/45 CSS(Common Command Set,通用指令集)
E 8W*^^z( CSS: Cascading Style Sheets,层叠格式表
SLkgIb~'X CTO(Chief Technology Officer,首席技术官)
bSI*`Dc"! CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
G
DBV CTS(Clear to Send,清除发送)
t`}=~/#`X CVS(Compute Visual Syndrome,计算机视觉综合症)